Contact Features Contact Base Material : Copper Alloy Contact Length : 22.89 MM [.901 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Retention Within Housing : With Contact Size : Size 22 Contact Type : Socket
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Length : 22.89 MM [.901 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Retention Within Housing : With Contact Size : Size 22 Contact Type : Socket
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Contact Features Contact Base Material : Copper Alloy Contact Length : 22.89 MM [.901 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Retention Within Housing : With Contact Size : Size 22 Contact Type : Socket
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Contact Features
Contact Base Material : Copper Alloy
Contact Length : 22.89 MM [.901 INCH ]
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Contact Retention Within Housing : With
Contact Size : Size 22
Contact Type : Socket
Mechanical Attachment
Contact Retention Type Within Housing : Retention Clip
Packaging Features
Packaging Method : Tray
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to Printed Circuit Board : Through Hole - Solder
