Body Features Connector Profile : Standard Frame Style : Open
Configuration Features Number of Positions : 20 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Gold Flash Contact Mating Area Plating Material Thickness (MICIN) : 25
Dimensions Row-to-Row Spacing : 7.62 MM [.3 INCH ]
Housing Features Centerline (Pitch) : 2.54 MM [.1 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Straight
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
TE Connectivity
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Description
Body Features Connector Profile : Standard Frame Style : Open
Configuration Features Number of Positions : 20 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Gold Flash Contact Mating Area Plating Material Thickness (MICIN) : 25
Dimensions Row-to-Row Spacing : 7.62 MM [.3 INCH ]
Housing Features Centerline (Pitch) : 2.54 MM [.1 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Straight
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features Connector Profile : Standard Frame Style : Open
Configuration Features Number of Positions : 20 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Gold Flash Contact Mating Area Plating Material Thickness (MICIN) : 25
Dimensions Row-to-Row Spacing : 7.62 MM [.3 INCH ]
Housing Features Centerline (Pitch) : 2.54 MM [.1 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Straight
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features
Connector Profile : Standard
Frame Style : Open
Configuration Features
Number of Positions : 20
PCB Mount Orientation : Vertical
Contact Features
Contact Current Rating (Max) (AMP) : 3
Contact Fabrication : Stamped & Formed
Contact Mating Area Plating Material : Gold Flash
Contact Mating Area Plating Material Thickness (MICIN) : 25
Dimensions
Row-to-Row Spacing : 7.62 MM [.3 INCH ]
Housing Features
Centerline (Pitch) : 2.54 MM [.1 INCH ]
Mechanical Attachment
Connector Mounting Type : Board Mount
Operation/Application
Circuit Application : Signal
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Leg Style : Straight
Termination Features
Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
