TE Connectivity DIP Sockets 4-1571552-5

Description
Body Features Connector Profile : Standard Configuration Features Number of Positions : 18 PCB Mount Orientation : Vertical Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 20 Dimensions Row-to-Row Spacing : 7.62 MM  [.3 INCH ] Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component Leg Style : Straight Sealable : No Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Description
Body Features Connector Profile : Standard Configuration Features Number of Positions : 18 PCB Mount Orientation : Vertical Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 20 Dimensions Row-to-Row Spacing : 7.62 MM  [.3 INCH ] Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component Leg Style : Straight Sealable : No Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Suppliers

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Description
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DIP Sockets - 4-1571552-5 - TE Connectivity
Berwyn, PA, United States
DIP Sockets
4-1571552-5
DIP Sockets 4-1571552-5
Body Features Connector Profile : Standard Configuration Features Number of Positions : 18 PCB Mount Orientation : Vertical Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 20 Dimensions Row-to-Row Spacing : 7.62 MM  [.3 INCH ] Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component Leg Style : Straight Sealable : No Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]

Body Features


  • Connector Profile : Standard

Configuration Features


  • Number of Positions : 18
  • PCB Mount Orientation : Vertical

Contact Features


  • Contact Current Rating (Max) (AMP) : 3
  • Contact Fabrication : Stamped & Formed
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Thickness (MICIN) : 20

Dimensions


  • Row-to-Row Spacing : 7.62 MM  [.3 INCH ]

Housing Features


  • Centerline (Pitch) : 2.54 MM  [.1 INCH ]

Mechanical Attachment


  • Connector Mounting Type : Board Mount

Operation/Application


  • Circuit Application : Signal

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Component
  • Leg Style : Straight
  • Sealable : No

Usage Conditions


  • Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Swedesboro, NJ, United States
Headers & Wire Housings
4-1571552-5
Headers & Wire Housings 4-1571552-5
Headers & Wire Housings

Headers & Wire Housings

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Technical Specifications

  TE Connectivity Powell Electronics, Inc.
Product Category IC Interconnect Components IC Interconnect Components
Product Number 4-1571552-5 4-1571552-5
Product Name DIP Sockets Headers & Wire Housings
Product Type IC Socket IC Headers
Socket Type DIP
Mounting Board Mount
Current Rating 3 amps
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