TE Connectivity SO DIMM Sockets 390113-1

Description
Body Features Connector Profile : Standard Ejector Location : None Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SDRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 144 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .25 MICM  [9.84 MICIN ] Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 3.3 Housing Features Centerline (Pitch) : .8 MM  [.031 INCH ] Housing Color : Natural Housing Material : High Temperature Plastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Offset Left PCB Mount Retention : With PCB Mount Retention Type : Hold-Down Post Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Small Outline (SO) Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Description
Body Features Connector Profile : Standard Ejector Location : None Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SDRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 144 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .25 MICM  [9.84 MICIN ] Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 3.3 Housing Features Centerline (Pitch) : .8 MM  [.031 INCH ] Housing Color : Natural Housing Material : High Temperature Plastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Offset Left PCB Mount Retention : With PCB Mount Retention Type : Hold-Down Post Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Small Outline (SO) Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Suppliers

Company
Product
Description
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SO DIMM Sockets - 390113-1 - TE Connectivity
Berwyn, PA, United States
SO DIMM Sockets
390113-1
SO DIMM Sockets 390113-1
Body Features Connector Profile : Standard Ejector Location : None Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SDRAM Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 144 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .25 MICM  [9.84 MICIN ] Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 6.2 MM  [.244 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 3.3 Housing Features Centerline (Pitch) : .8 MM  [.031 INCH ] Housing Color : Natural Housing Material : High Temperature Plastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Offset Left PCB Mount Retention : With PCB Mount Retention Type : Hold-Down Post Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Packaging Quantity : 20 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Small Outline (SO) Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]

Body Features


  • Connector Profile : Standard
  • Ejector Location : None
  • Latch Material : Stainless Steel
  • Latch Plating Material : Tin
  • Module Key Type : SDRAM

Configuration Features


  • Module Orientation : Right Angle
  • Number of Bays : 2
  • Number of Keys : 1
  • Number of Positions : 144
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Mating Area Plating Material : Gold (Au)
  • Contact Mating Area Plating Material Thickness : .25 MICM  [9.84 MICIN ]
  • Memory Socket Type : Memory Card
  • PCB Contact Termination Area Plating Material : Gold Flash

Dimensions


  • Row-to-Row Spacing : 6.2 MM  [.244 INCH ]
  • Stack Height : 5.2 MM  [.205 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 3.3

Housing Features


  • Centerline (Pitch) : .8 MM  [.031 INCH ]
  • Housing Color : Natural
  • Housing Material : High Temperature Plastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment Type : Offset Left
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Hold-Down Post

Operation/Application


  • Circuit Application : Signal

Packaging Features


  • Packaging Method : Tray
  • Packaging Quantity : 20

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Cable-to-Board
  • DRAM Type : Small Outline (SO)

Termination Features


  • Insertion Style : Cam-In
  • Termination Method to PCB : Surface Mount

Usage Conditions


  • Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Technical Specifications

  TE Connectivity
Product Category IC Interconnect Components
Product Number 390113-1
Product Name SO DIMM Sockets
Product Type IC Socket
Socket Type DIMM
Mounting SMT; Board Mount
Voltage Rating 3.3 volts
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