Body Features Connector Profile : High Ejector Location : None Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM
Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 144 Number of Rows : 2
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .25 MICM [9.84 MICIN ] Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold
Dimensions Row-to-Row Spacing : 6.2 MM [.244 INCH ] Stack Height : 5.6 MM [.22 INCH ]
Housing Features Centerline (Pitch) : .8 MM [.031 INCH ] Housing Color : Natural Housing Material : High Temperature Plastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Offset Left PCB Mount Retention : With PCB Mount Retention Type : Hold-Down Post
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray Packaging Quantity : 20
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Small Outline (SO)
Signal Characteristics SGRAM Voltage (V) : 3.3
Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
TE Connectivity
Done
Request a Quote
Email Supplier
Description
Body Features Connector Profile : High Ejector Location : None Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM
Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 144 Number of Rows : 2
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .25 MICM [9.84 MICIN ] Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold
Dimensions Row-to-Row Spacing : 6.2 MM [.244 INCH ] Stack Height : 5.6 MM [.22 INCH ]
Housing Features Centerline (Pitch) : .8 MM [.031 INCH ] Housing Color : Natural Housing Material : High Temperature Plastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Offset Left PCB Mount Retention : With PCB Mount Retention Type : Hold-Down Post
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray Packaging Quantity : 20
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Small Outline (SO)
Signal Characteristics SGRAM Voltage (V) : 3.3
Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features Connector Profile : High Ejector Location : None Latch Material : Stainless Steel Latch Plating Material : Tin Module Key Type : SGRAM
Configuration Features Module Orientation : Right Angle Number of Bays : 2 Number of Keys : 1 Number of Positions : 144 Number of Rows : 2
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .25 MICM [9.84 MICIN ] Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold
Dimensions Row-to-Row Spacing : 6.2 MM [.244 INCH ] Stack Height : 5.6 MM [.22 INCH ]
Housing Features Centerline (Pitch) : .8 MM [.031 INCH ] Housing Color : Natural Housing Material : High Temperature Plastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Offset Left PCB Mount Retention : With PCB Mount Retention Type : Hold-Down Post
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray Packaging Quantity : 20
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Small Outline (SO)
Signal Characteristics SGRAM Voltage (V) : 3.3
Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features
Connector Profile : High
Ejector Location : None
Latch Material : Stainless Steel
Latch Plating Material : Tin
Module Key Type : SGRAM
Configuration Features
Module Orientation : Right Angle
Number of Bays : 2
Number of Keys : 1
Number of Positions : 144
Number of Rows : 2
Contact Features
Contact Base Material : Copper Alloy
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .25 MICM [9.84 MICIN ]
Memory Socket Type : Memory Card
PCB Contact Termination Area Plating Material : Gold
Dimensions
Row-to-Row Spacing : 6.2 MM [.244 INCH ]
Stack Height : 5.6 MM [.22 INCH ]
Housing Features
Centerline (Pitch) : .8 MM [.031 INCH ]
Housing Color : Natural
Housing Material : High Temperature Plastic
Industry Standards
UL Flammability Rating : UL 94V-0
Mechanical Attachment
Connector Mounting Type : Board Mount
Mating Alignment Type : Offset Left
PCB Mount Retention : With
PCB Mount Retention Type : Hold-Down Post
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Tray
Packaging Quantity : 20
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Cable-to-Board
DRAM Type : Small Outline (SO)
Signal Characteristics
SGRAM Voltage (V) : 3.3
Termination Features
Insertion Style : Cam-In
Termination Method to PCB : Surface Mount
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
