Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 15 Contact Mating Area Plating Material : Tin (Sn) Contact Orientation : Straight Contact Retention Within Housing : With Contact Type : Socket Mating Pin Diameter : 2.11 MM [.083 INCH ] PCB Contact Termination Area Plating Material : Pre-Tin PCB Contact Termination Area Plating Material Thickness : .4 - 3.5 MICM [15.74 - 137.7 MICIN ]
Electrical Characteristics Operating Voltage (VAC) : 250 Operating Voltage (VDC) : 250
Mechanical Attachment Contact Retention Type Within Housing : Locking Lance
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
- Contact Base Material : Phosphor Bronze
- Contact Current Rating (Max) (AMP) : 15
- Contact Mating Area Plating Material : Tin (Sn)
- Contact Orientation : Straight
- Contact Retention Within Housing : With
- Contact Type : Socket
- Mating Pin Diameter : 2.11 MM [.083 INCH ]
- PCB Contact Termination Area Plating Material : Pre-Tin
- PCB Contact Termination Area Plating Material Thickness : .4 - 3.5 MICM [15.74 - 137.7 MICIN ]
Electrical Characteristics
- Operating Voltage (VAC) : 250
- Operating Voltage (VDC) : 250
Mechanical Attachment
- Contact Retention Type Within Housing : Locking Lance
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Bag
- Packaging Quantity : 1000
Termination Features
- Product Terminates To : Printed Circuit Board
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
