Configuration Features Backplane Architecture : Orthogonal Number of Positions : 14 PCB Mount Orientation : Vertical Stackable : No
Contact Features Contact Current Rating (Max) (AMP) : 9
Electrical Characteristics Operating Voltage (VAC) : 250 Operating Voltage (VDC) : 176
Housing Features Centerline (Pitch) : 4.2 MM [.165 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -25 - 85 DEGC [-13 - 185 DEGF ]
Configuration Features
- Backplane Architecture : Orthogonal
- Number of Positions : 14
- PCB Mount Orientation : Vertical
- Stackable : No
Contact Features
- Contact Current Rating (Max) (AMP) : 9
Electrical Characteristics
- Operating Voltage (VAC) : 250
- Operating Voltage (VDC) : 176
Housing Features
- Centerline (Pitch) : 4.2 MM [.165 INCH ]
Mechanical Attachment
- Connector Mounting Type : Board Mount
Operation/Application
- Circuit Application : Power
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Board-to-Board
- PCB Connector Type : PCB Mount Header
Termination Features
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -25 - 85 DEGC [-13 - 185 DEGF ]
