TE ConnectivityBoard-to-Board Headers & Receptacles3-1761614-4
Description
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 120 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Type : Tab Mating Tab Thickness : .2 MM [.008 INCH ] Mating Tab Width : 1 MM [.04 INCH ]
Dimensions PCB Thickness (Recommended) : 1.57 MM [.8 INCH ] Row-to-Row Spacing : 2 MM [.0786 INCH ] Stack Height (INCH) : .984
Housing Features Centerline (Pitch) : 1.3 MM [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without
Operation/Applicatio
n Assembly Process Feature : Pick and Place Cover Circuit Application : Power & Signal
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Header Type : Pin Header PCB Connector Assembly Type : PCB Mount Header Sealable : No
Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball
Usage Conditions Operating Temperature Range : 0 - 100 DEGC [32 - 212 DEGF ]
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Description
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 120 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Type : Tab Mating Tab Thickness : .2 MM [.008 INCH ] Mating Tab Width : 1 MM [.04 INCH ]
Dimensions PCB Thickness (Recommended) : 1.57 MM [.8 INCH ] Row-to-Row Spacing : 2 MM [.0786 INCH ] Stack Height (INCH) : .984
Housing Features Centerline (Pitch) : 1.3 MM [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without
Operation/Applicatio
n Assembly Process Feature : Pick and Place Cover Circuit Application : Power & Signal
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Header Type : Pin Header PCB Connector Assembly Type : PCB Mount Header Sealable : No
Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball
Usage Conditions Operating Temperature Range : 0 - 100 DEGC [32 - 212 DEGF ]
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 120 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Type : Tab Mating Tab Thickness : .2 MM [.008 INCH ] Mating Tab Width : 1 MM [.04 INCH ]
Dimensions PCB Thickness (Recommended) : 1.57 MM [.8 INCH ] Row-to-Row Spacing : 2 MM [.0786 INCH ] Stack Height (INCH) : .984
Housing Features Centerline (Pitch) : 1.3 MM [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without
Operation/Applicatio
n Assembly Process Feature : Pick and Place Cover Circuit Application : Power & Signal
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Header Type : Pin Header PCB Connector Assembly Type : PCB Mount Header Sealable : No
Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball
Usage Conditions Operating Temperature Range : 0 - 100 DEGC [32 - 212 DEGF ]
Configuration Features
Board-to-Board Configuration : Parallel
Number of Positions : 120
PCB Mount Orientation : Vertical
Contact Features
Contact Current Rating (Max) (AMP) : 1
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Contact Type : Tab
Mating Tab Thickness : .2 MM [.008 INCH ]
Mating Tab Width : 1 MM [.04 INCH ]
Dimensions
PCB Thickness (Recommended) : 1.57 MM [.8 INCH ]
Row-to-Row Spacing : 2 MM [.0786 INCH ]
Stack Height (INCH) : .984
Housing Features
Centerline (Pitch) : 1.3 MM [.051 INCH ]
Housing Color : Natural
Housing Material : Thermoplastic
Industry Standards
UL Flammability Rating : UL 94V-0
Mechanical Attachment
Connector Mounting Type : Board Mount
Mating Alignment : Without
Mating Retention : With
PCB Mount Alignment : Without
PCB Mount Retention : Without
Operation/Application
Assembly Process Feature : Pick and Place Cover
Circuit Application : Power & Signal
Packaging Features
Packaging Method : Package
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
Header Type : Pin Header
PCB Connector Assembly Type : PCB Mount Header
Sealable : No
Termination Features
Termination Method to Printed Circuit Board : Surface Mount - Solder Ball
Usage Conditions
Operating Temperature Range : 0 - 100 DEGC [32 - 212 DEGF ]
