TE Connectivity DIP Sockets 3-1437537-7

Description
Body Features Connector Profile : Standard Frame Style : Ladder, Open Sleeve Material : Brass Sleeve Plating Material : Gold Configuration Features Number of Positions : 16 Number of Rows : 2 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Screw Machine Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 25 Contact Type : Pin Mating Contact Type : Four-Fingered PCB Contact Termination Area Plating Material : Gold Socket Style : Standard Socket Type : DIP Dimensions Height Above PC Board : 2.67 MM  [.105 INCH ] Length (INCH) : .8 Row-to-Row Spacing : 7.62 MM  [.3 INCH ] Electrical Characteristics Contact Resistance (MOHM) : 10 Insulation Resistance (MEGO) : 5000 Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Housing Material : Polyester Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarization PCB Mount Retention : Without Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tube, Box & Tube Packaging Quantity : 30 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Straight Product Type : Socket Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post Length : 3.18 MM  [.125 INCH ] Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
  • DIP Sockets - 3-1437537-7 - TE Connectivity
    TE Connectivity
  • Socket, DIP;4-Fingered;16 Pos.;0.100In.cen.;Thru Hole;0.300In.;Ber. Copper;Gold - 70207060 - Allied Electronics, Inc.
    Allied Electronics, Inc.
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Description
Body Features Connector Profile : Standard Frame Style : Ladder, Open Sleeve Material : Brass Sleeve Plating Material : Gold Configuration Features Number of Positions : 16 Number of Rows : 2 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Screw Machine Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 25 Contact Type : Pin Mating Contact Type : Four-Fingered PCB Contact Termination Area Plating Material : Gold Socket Style : Standard Socket Type : DIP Dimensions Height Above PC Board : 2.67 MM  [.105 INCH ] Length (INCH) : .8 Row-to-Row Spacing : 7.62 MM  [.3 INCH ] Electrical Characteristics Contact Resistance (MOHM) : 10 Insulation Resistance (MEGO) : 5000 Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Housing Material : Polyester Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarization PCB Mount Retention : Without Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tube, Box & Tube Packaging Quantity : 30 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Straight Product Type : Socket Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post Length : 3.18 MM  [.125 INCH ] Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
DIP Sockets - 3-1437537-7 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
DIP Sockets
3-1437537-7
DIP Sockets 3-1437537-7
Body Features Connector Profile : Standard Frame Style : Ladder, Open Sleeve Material : Brass Sleeve Plating Material : Gold Configuration Features Number of Positions : 16 Number of Rows : 2 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Screw Machine Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 25 Contact Type : Pin Mating Contact Type : Four-Fingered PCB Contact Termination Area Plating Material : Gold Socket Style : Standard Socket Type : DIP Dimensions Height Above PC Board : 2.67 MM  [.105 INCH ] Length (INCH) : .8 Row-to-Row Spacing : 7.62 MM  [.3 INCH ] Electrical Characteristics Contact Resistance (MOHM) : 10 Insulation Resistance (MEGO) : 5000 Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Housing Material : Polyester Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarization PCB Mount Retention : Without Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tube, Box & Tube Packaging Quantity : 30 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Straight Product Type : Socket Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post Length : 3.18 MM  [.125 INCH ] Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]

Body Features


  • Connector Profile : Standard
  • Frame Style : Ladder, Open
  • Sleeve Material : Brass
  • Sleeve Plating Material : Gold

Configuration Features


  • Number of Positions : 16
  • Number of Rows : 2
  • PCB Mount Orientation : Vertical

Contact Features


  • Contact Base Material : Beryllium Copper
  • Contact Current Rating (Max) (AMP) : 3
  • Contact Fabrication : Screw Machine
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Thickness (MICIN) : 25
  • Contact Type : Pin
  • Mating Contact Type : Four-Fingered
  • PCB Contact Termination Area Plating Material : Gold
  • Socket Style : Standard
  • Socket Type : DIP

Dimensions


  • Height Above PC Board : 2.67 MM  [.105 INCH ]
  • Length (INCH) : .8
  • Row-to-Row Spacing : 7.62 MM  [.3 INCH ]

Electrical Characteristics


  • Contact Resistance (MOHM) : 10
  • Insulation Resistance (MEGO) : 5000

Housing Features


  • Centerline (Pitch) : 2.54 MM  [.1 INCH ]
  • Housing Material : Polyester

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : With
  • Mating Alignment Type : Polarization
  • PCB Mount Retention : Without

Operation/Application


  • Circuit Application : Signal

Packaging Features


  • Packaging Method : Tube, Box & Tube
  • Packaging Quantity : 30

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Leg Style : Straight
  • Product Type : Socket

Termination Features


  • Termination Method to Printed Circuit Board : Through Hole - Solder
  • Termination Post Length : 3.18 MM  [.125 INCH ]

Usage Conditions


  • Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Socket, DIP;4-Fingered;16 Pos.;0.100In.cen.;Thru Hole;0.300In.;Ber. Copper;Gold - 70207060 - Allied Electronics, Inc.
Allied Electronics, Inc.
Fort Worth, TX, USA
Socket, DIP;4-Fingered;16 Pos.;0.100In.cen.;Thru Hole;0.300In.;Ber. Copper;Gold
70207060
Socket, DIP;4-Fingered;16 Pos.;0.100In.cen.;Thru Hole;0.300In.;Ber. Copper;Gold 70207060
AMP DIP Socket, Beryllium Copper Contact Material, 0.100 " Centerline, 0.125 " Terminal Post Length Precision Four-Finger Inner Contact Provides Concentric Funnel Entry for Easy Flat and Round Lead Insertion BeCu Inner Contact for Maximum Mechanical and Electrical Performance PC Board Thickness Range: 0.062" and 0.092" PC Termination: 0.125" Contact Spacing: 0.100 Centers Recognized Under the Component Program of Underwriters Laboratories, Inc. File No. E111362

AMP DIP Socket, Beryllium Copper Contact Material, 0.100 " Centerline, 0.125 " Terminal Post Length

  • Precision Four-Finger Inner Contact Provides Concentric Funnel Entry for Easy Flat and Round Lead Insertion
  • BeCu Inner Contact for Maximum Mechanical and Electrical Performance
  • PC Board Thickness Range: 0.062" and 0.092"
  • PC Termination: 0.125"
  • Contact Spacing: 0.100 Centers
  • Recognized Under the Component Program of Underwriters Laboratories, Inc. File No. E111362
Supplier's Site

Technical Specifications

  TE Connectivity Allied Electronics, Inc.
Product Category IC Interconnect Components IC Interconnect Components
Product Number 3-1437537-7 70207060
Product Name DIP Sockets Socket, DIP;4-Fingered;16 Pos.;0.100In.cen.;Thru Hole;0.300In.;Ber. Copper;Gold
Product Type IC Socket IC Socket
Socket Type DIP DIP
Mounting Board Mount Solder
Current Rating 3 amps 3 amps
Insulation Resistance 5000 Mohms
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