TE Connectivity DIP Sockets 3-1437514-1

Description
Body Features Connector Profile : Zero Frame Style : Film Carrier, Open Configuration Features Number of Positions : 1 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Solid Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 25 Contact Type : Socket IC Socket Type : DIP Mating Contact Type : Four-Fingered Dimensions Profile Height from PCB : 0 MM  [0 INCH ] Row-to-Row Spacing : 15.24 MM  [.6 INCH ] Electrical Characteristics Contact Resistance (MOHM) : 10 Insulation Resistance (MEGO) : 1000 Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Reel Packaging Quantity : 5000 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Through Hole Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit Termination Post & Tail Length : 3.18 MM  [.125 INCH ] Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Description
Body Features Connector Profile : Zero Frame Style : Film Carrier, Open Configuration Features Number of Positions : 1 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Solid Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 25 Contact Type : Socket IC Socket Type : DIP Mating Contact Type : Four-Fingered Dimensions Profile Height from PCB : 0 MM  [0 INCH ] Row-to-Row Spacing : 15.24 MM  [.6 INCH ] Electrical Characteristics Contact Resistance (MOHM) : 10 Insulation Resistance (MEGO) : 1000 Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Reel Packaging Quantity : 5000 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Through Hole Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit Termination Post & Tail Length : 3.18 MM  [.125 INCH ] Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
DIP Sockets - 3-1437514-1 - TE Connectivity
Berwyn, PA, United States
DIP Sockets
3-1437514-1
DIP Sockets 3-1437514-1
Body Features Connector Profile : Zero Frame Style : Film Carrier, Open Configuration Features Number of Positions : 1 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Solid Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 25 Contact Type : Socket IC Socket Type : DIP Mating Contact Type : Four-Fingered Dimensions Profile Height from PCB : 0 MM  [0 INCH ] Row-to-Row Spacing : 15.24 MM  [.6 INCH ] Electrical Characteristics Contact Resistance (MOHM) : 10 Insulation Resistance (MEGO) : 1000 Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Reel Packaging Quantity : 5000 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Through Hole Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit Termination Post & Tail Length : 3.18 MM  [.125 INCH ] Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]

Body Features


  • Connector Profile : Zero
  • Frame Style : Film Carrier, Open

Configuration Features


  • Number of Positions : 1
  • PCB Mount Orientation : Vertical

Contact Features


  • Contact Base Material : Beryllium Copper
  • Contact Current Rating (Max) (AMP) : 3
  • Contact Fabrication : Solid
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Thickness (MICIN) : 25
  • Contact Type : Socket
  • IC Socket Type : DIP
  • Mating Contact Type : Four-Fingered

Dimensions


  • Profile Height from PCB : 0 MM  [0 INCH ]
  • Row-to-Row Spacing : 15.24 MM  [.6 INCH ]

Electrical Characteristics


  • Contact Resistance (MOHM) : 10
  • Insulation Resistance (MEGO) : 1000

Housing Features


  • Centerline (Pitch) : 2.54 MM  [.1 INCH ]

Mechanical Attachment


  • Connector Mounting Type : Board Mount

Operation/Application


  • Circuit Application : Signal

Packaging Features


  • Packaging Method : Reel
  • Packaging Quantity : 5000

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Leg Style : Through Hole

Termination Features


  • Termination Method to Printed Circuit Board : Through Hole - Press-Fit
  • Termination Post & Tail Length : 3.18 MM  [.125 INCH ]

Usage Conditions


  • Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Headers & Wire Housings - 3-1437514-1 - Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
3-1437514-1
Headers & Wire Housings 3-1437514-1
HOLTITE REEL AS

HOLTITE REEL AS

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Technical Specifications

  TE Connectivity Powell Electronics, Inc.
Product Category IC Interconnect Components IC Interconnect Components
Product Number 3-1437514-1 3-1437514-1
Product Name DIP Sockets Headers & Wire Housings
Product Type IC Socket IC Headers
Socket Type DIP
Mounting Board Mount
Current Rating 3 amps
Insulation Resistance 1000 Mohms
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