Configuration Features Number of Positions : 1 Side Protected : No
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 1 Contact Underplating Material : Nickel Contact Working Range (High) : 2.1 MM [.083 INCH ] Contact Working Range (Low) : 2.5 MM [.098 INCH ] PCB Contact Termination Area Plating Material : Gold Point of Contact Area Plating Material : Gold
Dimensions Product Diameter : 1.5 MM [.059 INCH ] Uncompressed Height : 3 MM [.118 INCH ]
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tape & Reel
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component Scalable : No Spring Finger Type : Pogo Pins
Usage Conditions Operating Temperature Range : -40 - 85 DEGC [-40 - 185 DEGF ]
TE Connectivity
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Description
Configuration Features Number of Positions : 1 Side Protected : No
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 1 Contact Underplating Material : Nickel Contact Working Range (High) : 2.1 MM [.083 INCH ] Contact Working Range (Low) : 2.5 MM [.098 INCH ] PCB Contact Termination Area Plating Material : Gold Point of Contact Area Plating Material : Gold
Dimensions Product Diameter : 1.5 MM [.059 INCH ] Uncompressed Height : 3 MM [.118 INCH ]
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tape & Reel
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component Scalable : No Spring Finger Type : Pogo Pins
Usage Conditions Operating Temperature Range : -40 - 85 DEGC [-40 - 185 DEGF ]
Configuration Features Number of Positions : 1 Side Protected : No
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 1 Contact Underplating Material : Nickel Contact Working Range (High) : 2.1 MM [.083 INCH ] Contact Working Range (Low) : 2.5 MM [.098 INCH ] PCB Contact Termination Area Plating Material : Gold Point of Contact Area Plating Material : Gold
Dimensions Product Diameter : 1.5 MM [.059 INCH ] Uncompressed Height : 3 MM [.118 INCH ]
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tape & Reel
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component Scalable : No Spring Finger Type : Pogo Pins
Usage Conditions Operating Temperature Range : -40 - 85 DEGC [-40 - 185 DEGF ]
Configuration Features
Number of Positions : 1
Side Protected : No
Contact Features
Contact Base Material : Brass
Contact Current Rating (Max) (AMP) : 1
Contact Underplating Material : Nickel
Contact Working Range (High) : 2.1 MM [.083 INCH ]
Contact Working Range (Low) : 2.5 MM [.098 INCH ]
PCB Contact Termination Area Plating Material : Gold
Point of Contact Area Plating Material : Gold
Dimensions
Product Diameter : 1.5 MM [.059 INCH ]
Uncompressed Height : 3 MM [.118 INCH ]
Operation/Application
Circuit Application : Power
Packaging Features
Packaging Method : Tape & Reel
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Component
Scalable : No
Spring Finger Type : Pogo Pins
Usage Conditions
Operating Temperature Range : -40 - 85 DEGC [-40 - 185 DEGF ]
