Contact Features Contact Base Material : Copper Nickel Tin Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Retention Within Housing : Without Contact Size : 1.3mm Contact Type : Receptacle Wire Contact Termination Area Plating Material : Gold Flash
Dimensions Wire Size (MMSQ) : .081 - .0127 Wire Size (AWG) : 28 - 30 Wire Size (CMA) : 100.5 - 159.8
Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 500 Insulation Resistance (MEGO) : 100 Operating Voltage (VAC) : 50 Operating Voltage (VDC) : 50
Operation/Applicatio
n Circuit Application : Power & Signal
Product Type Features Sealable : No
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -25 - 85 DEGC [-13 - 185 DEGF ]
Contact Features
- Contact Base Material : Copper Nickel Tin
- Contact Current Rating (Max) (AMP) : 1
- Contact Mating Area Plating Material : Gold (Au)
- Contact Retention Within Housing : Without
- Contact Size : 1.3mm
- Contact Type : Receptacle
- Wire Contact Termination Area Plating Material : Gold Flash
Dimensions
- Wire Size (MMSQ) : .081 - .0127
- Wire Size (AWG) : 28 - 30
- Wire Size (CMA) : 100.5 - 159.8
Electrical Characteristics
- Dielectric Withstanding Voltage (Max) (VAC) : 500
- Insulation Resistance (MEGO) : 100
- Operating Voltage (VAC) : 50
- Operating Voltage (VDC) : 50
Operation/Application
- Circuit Application : Power & Signal
Product Type Features
Termination Features
- Product Terminates To : Printed Circuit Board
- Termination Method to Wire & Cable : Crimp
Usage Conditions
- Operating Temperature Range : -25 - 85 DEGC [-13 - 185 DEGF ]
