TE ConnectivityHigh Speed Backplane Connectors2476413-2
Description
Configuration Features Guide Location : End Number of Columns : 8 Number of Positions : 228 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : .75
Dimensions Row-to-Row Spacing : 2.15 MM [.085 INCH ]
Housing Features Centerline (Pitch) : 2.15 MM [.085 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Guide Post
Operation/Applicatio
n Circuit Application : High Speed Data
Usage Conditions Operating Temperature Range (DEGC) : -55 - 105
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Description
Configuration Features Guide Location : End Number of Columns : 8 Number of Positions : 228 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : .75
Dimensions Row-to-Row Spacing : 2.15 MM [.085 INCH ]
Housing Features Centerline (Pitch) : 2.15 MM [.085 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Guide Post
Operation/Applicatio
n Circuit Application : High Speed Data
Usage Conditions Operating Temperature Range (DEGC) : -55 - 105
Configuration Features Guide Location : End Number of Columns : 8 Number of Positions : 228 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : .75
Dimensions Row-to-Row Spacing : 2.15 MM [.085 INCH ]
Housing Features Centerline (Pitch) : 2.15 MM [.085 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Guide Post
Operation/Applicatio
n Circuit Application : High Speed Data
Usage Conditions Operating Temperature Range (DEGC) : -55 - 105
