TE ConnectivityHard Metric Backplane Connectors2472335-1
Description
Body Features Primary Product Color : Gray
Configuration Features Backplane Architecture : Traditional Backplane Number of Columns : 10 Number of Positions : 120 Number of Rows : 3
Contact Features Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold or Gold Flash over Palladium Nickel Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Housing Features Centerline (Pitch) : 2.5 MM [.098 INCH ]
Operation/Applicatio
n Circuit Application : High Speed Data
Packaging Features Packaging Method : Tube
Product Type Features PCB Connector Type : PCB Mount Header Sealable : No
Signal Characteristics Data Rate (GBS) : 56
Usage Conditions Operating Temperature Range : 0 - 105 DEGC [32 - 221 DEGF ]
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Description
Body Features Primary Product Color : Gray
Configuration Features Backplane Architecture : Traditional Backplane Number of Columns : 10 Number of Positions : 120 Number of Rows : 3
Contact Features Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold or Gold Flash over Palladium Nickel Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Housing Features Centerline (Pitch) : 2.5 MM [.098 INCH ]
Operation/Applicatio
n Circuit Application : High Speed Data
Packaging Features Packaging Method : Tube
Product Type Features PCB Connector Type : PCB Mount Header Sealable : No
Signal Characteristics Data Rate (GBS) : 56
Usage Conditions Operating Temperature Range : 0 - 105 DEGC [32 - 221 DEGF ]
Body Features Primary Product Color : Gray
Configuration Features Backplane Architecture : Traditional Backplane Number of Columns : 10 Number of Positions : 120 Number of Rows : 3
Contact Features Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold or Gold Flash over Palladium Nickel Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Housing Features Centerline (Pitch) : 2.5 MM [.098 INCH ]
Operation/Applicatio
n Circuit Application : High Speed Data
Packaging Features Packaging Method : Tube
Product Type Features PCB Connector Type : PCB Mount Header Sealable : No
Signal Characteristics Data Rate (GBS) : 56
Usage Conditions Operating Temperature Range : 0 - 105 DEGC [32 - 221 DEGF ]
Body Features
Primary Product Color : Gray
Configuration Features
Backplane Architecture : Traditional Backplane
Number of Columns : 10
Number of Positions : 120
Number of Rows : 3
Contact Features
Contact Current Rating (Max) (AMP) : .5
Contact Mating Area Plating Material : Gold or Gold Flash over Palladium Nickel
Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Housing Features
Centerline (Pitch) : 2.5 MM [.098 INCH ]
Operation/Application
Circuit Application : High Speed Data
Packaging Features
Packaging Method : Tube
Product Type Features
PCB Connector Type : PCB Mount Header
Sealable : No
Signal Characteristics
Data Rate (GBS) : 56
Usage Conditions
Operating Temperature Range : 0 - 105 DEGC [32 - 221 DEGF ]
