Configuration Features Number of Positions : 40
Contact Features Contact Current Rating (Max) (AMP) : 1.5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Tail Plating Material : Tin
Electrical Characteristics Data Rate (Max) (GBS) : 112
Industry Standards UL Flammability Rating : UL 94V-0
Operation/Applicatio
n Circuit Application : High Speed Data Pluggable I/O Applications : SFP112
Packaging Features Packaging Method : Box & Tray
Product Type Features Pluggable Form Factor : SFP Pluggable I/O Product Type : Connector Sealable : No
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
Configuration Features
Contact Features
- Contact Current Rating (Max) (AMP) : 1.5
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness (MICIN) : 30
- Contact Underplating Material : Nickel
- PCB Contact Termination Area Plating Material : Gold
- Tail Plating Material : Tin
Electrical Characteristics
- Data Rate (Max) (GBS) : 112
Industry Standards
- UL Flammability Rating : UL 94V-0
Operation/Application
- Circuit Application : High Speed Data
- Pluggable I/O Applications : SFP112
Packaging Features
- Packaging Method : Box & Tray
Product Type Features
- Pluggable Form Factor : SFP
- Pluggable I/O Product Type : Connector
- Sealable : No
Termination Features
- Termination Method to PCB : Surface Mount
Usage Conditions
- Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]