Configuration Features Number of Positions : 16
Contact Features Contact Current Rating (Max) (AMP) : 1 Contact Fabrication : Solid Contact Mating Area Plating Material : Tin (Sn)
Dimensions Row-to-Row Spacing : 7.62 MM [.3 INCH ]
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : SMD Pads
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
TE Connectivity
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Description
Configuration Features Number of Positions : 16
Contact Features Contact Current Rating (Max) (AMP) : 1 Contact Fabrication : Solid Contact Mating Area Plating Material : Tin (Sn)
Dimensions Row-to-Row Spacing : 7.62 MM [.3 INCH ]
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : SMD Pads
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Configuration Features Number of Positions : 16
Contact Features Contact Current Rating (Max) (AMP) : 1 Contact Fabrication : Solid Contact Mating Area Plating Material : Tin (Sn)
Dimensions Row-to-Row Spacing : 7.62 MM [.3 INCH ]
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : SMD Pads
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Configuration Features
Number of Positions : 16
Contact Features
Contact Current Rating (Max) (AMP) : 1
Contact Fabrication : Solid
Contact Mating Area Plating Material : Tin (Sn)
Dimensions
Row-to-Row Spacing : 7.62 MM [.3 INCH ]
Operation/Application
Circuit Application : Signal
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Leg Style : SMD Pads
Usage Conditions
Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
