Configuration Features Number of Ports : 2 Number of Positions : 76 Port Matrix Configuration : 2 x 1
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Electrical Characteristics Data Rate (Max) (GBS) : 112
Housing Features Centerline (Pitch) : .8 MM [.031 INCH ] Housing Material : Liquid Crystal Polymer (LCP)
Industry Standards UL Flammability Rating : UL 94V-0
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray/Box
Product Type Features Pluggable Form Factor : QSFP112 Pluggable I/O Product Type : Connector
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Configuration Features
- Number of Ports : 2
- Number of Positions : 76
- Port Matrix Configuration : 2 x 1
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : .5
- Contact Mating Area Plating Material : Gold (Au)
- Contact Underplating Material : Nickel
- PCB Contact Termination Area Plating Material : Tin
Electrical Characteristics
- Data Rate (Max) (GBS) : 112
Housing Features
- Centerline (Pitch) : .8 MM [.031 INCH ]
- Housing Material : Liquid Crystal Polymer (LCP)
Industry Standards
- UL Flammability Rating : UL 94V-0
Operation/Application
- Circuit Application : Signal
Packaging Features
- Packaging Method : Tray/Box
Product Type Features
- Pluggable Form Factor : QSFP112
- Pluggable I/O Product Type : Connector
Termination Features
- Termination Method to PCB : Surface Mount
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
