Configuration Features Grid Spacing (MM) : 0.7424x0.259 Number of Positions : 100
Contact Features Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material Thickness : .076 MICM [3 MICIN ] IC Socket Type : LGA 2010
Product Type Features Connector & Contact Terminates To : Flexible Printed Circuit (FPC)
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range (DEGC) : -25 - 105
TE Connectivity
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Description
Configuration Features Grid Spacing (MM) : 0.7424x0.259 Number of Positions : 100
Contact Features Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material Thickness : .076 MICM [3 MICIN ] IC Socket Type : LGA 2010
Product Type Features Connector & Contact Terminates To : Flexible Printed Circuit (FPC)
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range (DEGC) : -25 - 105
Configuration Features Grid Spacing (MM) : 0.7424x0.259 Number of Positions : 100
Contact Features Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material Thickness : .076 MICM [3 MICIN ] IC Socket Type : LGA 2010
Product Type Features Connector & Contact Terminates To : Flexible Printed Circuit (FPC)
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range (DEGC) : -25 - 105
Configuration Features
Grid Spacing (MM) : 0.7424x0.259
Number of Positions : 100
Contact Features
Contact Current Rating (Max) (AMP) : .5
Contact Mating Area Plating Material Thickness : .076 MICM [3 MICIN ]
IC Socket Type : LGA 2010
Product Type Features
Connector & Contact Terminates To : Flexible Printed Circuit (FPC)
