Configuration Features Grid Spacing (MM) : .81389 x .9398 Number of Positions : 7529
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] IC Socket Type : LGA 7529
Mechanical Attachment Connector Mounting Type : Board Mount
Packaging Features Packaging Method : Tray/Box Tray Color : Black
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component
Termination Features Termination Method to PCB : Surface Mount - Solder Ball
TE Connectivity
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Description
Configuration Features Grid Spacing (MM) : .81389 x .9398 Number of Positions : 7529
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] IC Socket Type : LGA 7529
Mechanical Attachment Connector Mounting Type : Board Mount
Packaging Features Packaging Method : Tray/Box Tray Color : Black
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component
Termination Features Termination Method to PCB : Surface Mount - Solder Ball
Configuration Features Grid Spacing (MM) : .81389 x .9398 Number of Positions : 7529
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] IC Socket Type : LGA 7529
Mechanical Attachment Connector Mounting Type : Board Mount
Packaging Features Packaging Method : Tray/Box Tray Color : Black
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Component
Termination Features Termination Method to PCB : Surface Mount - Solder Ball
Configuration Features
Grid Spacing (MM) : .81389 x .9398
Number of Positions : 7529
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : .5
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
IC Socket Type : LGA 7529
Mechanical Attachment
Connector Mounting Type : Board Mount
Packaging Features
Packaging Method : Tray/Box
Tray Color : Black
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Component
Termination Features
Termination Method to PCB : Surface Mount - Solder Ball
