TE ConnectivityHigh Speed Backplane Connectors2364030-2
Description
Body Features Primary Product Color : Black
Configuration Features Backplane Architecture : Traditional Backplane Number of Columns : 16 Number of Positions : 144 Number of Rows : 9 PCB Mount Orientation : Vertical
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Dimensions Row-to-Row Spacing : 1.8 MM [.071 INCH ]
Housing Features Centerline (Pitch) : 1.8 MM [.071 INCH ] Housing Material : Liquid Crystal Polymer (LCP) GF
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power, Signal & High Speed Data
Packaging Features Packaging Method : Tube
Product Type Features Compatible with PCB Type : Backplane Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Receptacle Shroud Style : Unshrouded
Termination Features Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
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Datasheet
Description
Body Features Primary Product Color : Black
Configuration Features Backplane Architecture : Traditional Backplane Number of Columns : 16 Number of Positions : 144 Number of Rows : 9 PCB Mount Orientation : Vertical
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Dimensions Row-to-Row Spacing : 1.8 MM [.071 INCH ]
Housing Features Centerline (Pitch) : 1.8 MM [.071 INCH ] Housing Material : Liquid Crystal Polymer (LCP) GF
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power, Signal & High Speed Data
Packaging Features Packaging Method : Tube
Product Type Features Compatible with PCB Type : Backplane Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Receptacle Shroud Style : Unshrouded
Termination Features Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features Primary Product Color : Black
Configuration Features Backplane Architecture : Traditional Backplane Number of Columns : 16 Number of Positions : 144 Number of Rows : 9 PCB Mount Orientation : Vertical
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Dimensions Row-to-Row Spacing : 1.8 MM [.071 INCH ]
Housing Features Centerline (Pitch) : 1.8 MM [.071 INCH ] Housing Material : Liquid Crystal Polymer (LCP) GF
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power, Signal & High Speed Data
Packaging Features Packaging Method : Tube
Product Type Features Compatible with PCB Type : Backplane Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Receptacle Shroud Style : Unshrouded
Termination Features Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features
Primary Product Color : Black
Configuration Features
Backplane Architecture : Traditional Backplane
Number of Columns : 16
Number of Positions : 144
Number of Rows : 9
PCB Mount Orientation : Vertical
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : 1
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Tin
PCB Contact Termination Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Dimensions
Row-to-Row Spacing : 1.8 MM [.071 INCH ]
Housing Features
Centerline (Pitch) : 1.8 MM [.071 INCH ]
Housing Material : Liquid Crystal Polymer (LCP) GF
Mechanical Attachment
Connector Mounting Type : Board Mount
Operation/Application
Circuit Application : Power, Signal & High Speed Data
Packaging Features
Packaging Method : Tube
Product Type Features
Compatible with PCB Type : Backplane
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
PCB Connector Type : PCB Mount Receptacle
Shroud Style : Unshrouded
Termination Features
Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]