TE Connectivity Headers & Wire Housings 2361355-1

Description
C/A, Sliver 2.0 4C, STR to RA, 0.5M
  • Headers & Wire Housings - 2361355-1 - Powell Electronics, Inc.
    Powell Electronics, Inc.
Request a Quote
Description
C/A, Sliver 2.0 4C, STR to RA, 0.5M
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Headers & Wire Housings - 2361355-1 - Powell Electronics, Inc.
Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
2361355-1
Headers & Wire Housings 2361355-1
C/A, Sliver 2.0 4C, STR to RA, 0.5M

C/A, Sliver 2.0 4C, STR to RA, 0.5M

Buy Now
Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
2361355-1
Headers & Wire Housings 2361355-1
Headers & Wire Housings

Headers & Wire Housings

Buy Now

Technical Specifications

  Powell Electronics, Inc.
Product Category IC Interconnect Components
Product Number 2361355-1
Product Name Headers & Wire Housings
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Related Documents

Similar Products

DDR4 SMT - 10148176-2321413LF - Amphenol Communications Solutions
Amphenol Communications Solutions
DDR4 SMT
10148176-2321413LF
Specs
Product Type IC Socket
Mounting SMT
View Details
775E Series CSP/FBGA Devices - - Sensata Technologies
Sensata Technologies
775E Series CSP/FBGA Devices
Specs
Product Type IC Socket
Contact Resistance 300 milliohms
Operating Temperature 150 C (302 F)
View Details
PCB Headers & Receptacles - 103168-3 - TE Connectivity
TE Connectivity
PCB Headers & Receptacles
103168-3
Specs
Mounting Through-Hole; Board Mount
Current Rating 3 amps
Insulation Resistance 5000 Mohms
View Details
2 suppliers
Headers & Wire Housings - G125-MS11005M3P - Powell Electronics, Inc.
Harwin Plc
Headers & Wire Housings
G125-MS11005M3P
Specs
Product Type IC Headers
View Details