Configuration Features Number of Dual Positions : 25 Number of Positions : 50 Number of Power Positions : 50 Number of Signal Positions : 0
Contact Features Contact Current Rating (Max) (AMP) : 9.3 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Dimensions Power Contact Centerline : 2.54 MM [.1 INCH ]
Electrical Characteristics Operating Voltage (VAC) : 100 Operating Voltage (VDC) : 100 Operating Voltage (V) : 100
Housing Features Centerline (Pitch) : 2.54 MM [.1 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power & Signal
Product Type Features Card Edge Type : Single-Beam Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Configuration Features
- Number of Dual Positions : 25
- Number of Positions : 50
- Number of Power Positions : 50
- Number of Signal Positions : 0
Contact Features
- Contact Current Rating (Max) (AMP) : 9.3
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Dimensions
- Power Contact Centerline : 2.54 MM [.1 INCH ]
Electrical Characteristics
- Operating Voltage (VAC) : 100
- Operating Voltage (VDC) : 100
- Operating Voltage (V) : 100
Housing Features
- Centerline (Pitch) : 2.54 MM [.1 INCH ]
Mechanical Attachment
- Connector Mounting Type : Board Mount
Operation/Application
- Circuit Application : Power & Signal
Product Type Features
- Card Edge Type : Single-Beam
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Board-to-Board
Termination Features
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
