Body Features Primary Product Color : Natural
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 114 Number of Rows : 6 PCB Mount Orientation : Vertical Stackable : Yes
Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 1.5 Contact Layout : Matrix Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Type : Socket Mating Tab Thickness : .46 MM [.018 INCH ] Mating Tab Width : .43 MM [.017 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions Connector Height : 6 MM [.236 INCH ] Row-to-Row Spacing : 1.27 MM [.05 INCH ] Stack Height : 10 MM [.394 INCH ]
Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 750 Operating Voltage (VAC) : 250
Housing Features Centerline (Pitch) : 1.27 MM [.05 INCH ] Housing Material : Liquid Crystal Polymer (LCP)
Industry Standards Industry Standard : VITA 61 UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Keyed PCB Mount Alignment : Without PCB Mount Retention : Without
Operation/Applicatio
n Assembly Process Feature : Pick and Place Cover Circuit Application : Signal
Packaging Features Packaging Method : Tape & Reel Packaging Quantity : 450
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Product Type : Connector Assembly Connector System : Board-to-Board PCB Connector Type : PCB Mount Receptacle Sealable : No
Termination Features Termination Method to PCB : Surface Mount - Solder Ball
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Body Features
- Primary Product Color : Natural
Configuration Features
- Board-to-Board Configuration : Parallel
- Number of Positions : 114
- Number of Rows : 6
- PCB Mount Orientation : Vertical
- Stackable : Yes
Contact Features
- Contact Base Material : Beryllium Copper
- Contact Current Rating (Max) (AMP) : 1.5
- Contact Layout : Matrix
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
- Contact Type : Socket
- Mating Tab Thickness : .46 MM [.018 INCH ]
- Mating Tab Width : .43 MM [.017 INCH ]
- PCB Contact Termination Area Plating Material : Tin-Lead
Dimensions
- Connector Height : 6 MM [.236 INCH ]
- Row-to-Row Spacing : 1.27 MM [.05 INCH ]
- Stack Height : 10 MM [.394 INCH ]
Electrical Characteristics
- Dielectric Withstanding Voltage (Max) (VAC) : 750
- Operating Voltage (VAC) : 250
Housing Features
- Centerline (Pitch) : 1.27 MM [.05 INCH ]
- Housing Material : Liquid Crystal Polymer (LCP)
Industry Standards
- Industry Standard : VITA 61
- UL Flammability Rating : UL 94V-0
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Alignment : With
- Mating Alignment Type : Keyed
- PCB Mount Alignment : Without
- PCB Mount Retention : Without
Operation/Application
- Assembly Process Feature : Pick and Place Cover
- Circuit Application : Signal
Packaging Features
- Packaging Method : Tape & Reel
- Packaging Quantity : 450
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector Product Type : Connector Assembly
- Connector System : Board-to-Board
- PCB Connector Type : PCB Mount Receptacle
- Sealable : No
Termination Features
- Termination Method to PCB : Surface Mount - Solder Ball
Usage Conditions
- Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
