Configuration Features Number of Dual Positions : 14 Number of Positions : 26 Number of Power Positions : 12 Number of Signal Positions : 14
Contact Features Contact Current Rating (Max) (AMP) : 41 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Dimensions Power Contact Centerline : 7.62 MM [.3 INCH ]
Electrical Characteristics Operating Voltage (VAC) : 100 Operating Voltage (VDC) : 100 Operating Voltage (V) : 100
Housing Features Centerline (Pitch) : 7.62 MM [.3 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power & Signal
Product Type Features Card Edge Type : HD+ Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 100 DEGC [-67 - 212 DEGF ]
Configuration Features
- Number of Dual Positions : 14
- Number of Positions : 26
- Number of Power Positions : 12
- Number of Signal Positions : 14
Contact Features
- Contact Current Rating (Max) (AMP) : 41
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Dimensions
- Power Contact Centerline : 7.62 MM [.3 INCH ]
Electrical Characteristics
- Operating Voltage (VAC) : 100
- Operating Voltage (VDC) : 100
- Operating Voltage (V) : 100
Housing Features
- Centerline (Pitch) : 7.62 MM [.3 INCH ]
Mechanical Attachment
- Connector Mounting Type : Board Mount
Operation/Application
- Circuit Application : Power & Signal
Product Type Features
- Card Edge Type : HD+
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Board-to-Board
Termination Features
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -55 - 100 DEGC [-67 - 212 DEGF ]
