Body Features Heat Sink Finish : Anodized Heat Sink Height Class : PCI Heat Sink Style : Fin
Configuration Features Number of Ports : 2 Number of Positions : 76 Number of Rear EONs per Port Column : 3 Port Matrix Configuration : 2 x 1
Contact Features PCB Contact Termination Area Plating Material : Gold
Electrical Characteristics Data Rate (Max) (GBS) : 56
Housing Features Cage Material : Stainless Steel Centerline (Pitch) (MM) : .8
Operation/Applicatio
n Circuit Application : High Speed Data Pluggable I/O Applications : QSFP DD
Other EMI Containment Feature Type : Internal/External EMI Springs Included Lightpipe : No
Packaging Features Packaging Method : Tray
Product Type Features Cage Type : Stacked Pluggable Form Factor : QSFP-DD Thermal Accessory Type Included : Heat Sink
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -40 - 85 DEGC [-40 - 185 DEGF ]
Body Features
- Heat Sink Finish : Anodized
- Heat Sink Height Class : PCI
- Heat Sink Style : Fin
Configuration Features
- Number of Ports : 2
- Number of Positions : 76
- Number of Rear EONs per Port Column : 3
- Port Matrix Configuration : 2 x 1
Contact Features
- PCB Contact Termination Area Plating Material : Gold
Electrical Characteristics
- Data Rate (Max) (GBS) : 56
Housing Features
- Cage Material : Stainless Steel
- Centerline (Pitch) (MM) : .8
Operation/Application
- Circuit Application : High Speed Data
- Pluggable I/O Applications : QSFP DD
Other
- EMI Containment Feature Type : Internal/External EMI Springs
- Included Lightpipe : No
Packaging Features
Product Type Features
- Cage Type : Stacked
- Pluggable Form Factor : QSFP-DD
- Thermal Accessory Type Included : Heat Sink
Termination Features
- Termination Method to PCB : Surface Mount
Usage Conditions
- Operating Temperature Range : -40 - 85 DEGC [-40 - 185 DEGF ]
