Configuration Features Number of Positions : 52 Number of Power Positions : 8 Number of Signal Positions : 44
Contact Features Contact Current Rating (Max) (AMP) : 50 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Underplating Material : Nickel
Dimensions Power Contact Centerline : 5.08 MM [.2 INCH ]
Electrical Characteristics Operating Voltage (V) : 100
Housing Features Centerline (Pitch) : 5.08 MM [.2 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power & Signal
Product Type Features Card Edge Type : HD+ Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Configuration Features
- Number of Positions : 52
- Number of Power Positions : 8
- Number of Signal Positions : 44
Contact Features
- Contact Current Rating (Max) (AMP) : 50
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
- Contact Underplating Material : Nickel
Dimensions
- Power Contact Centerline : 5.08 MM [.2 INCH ]
Electrical Characteristics
- Operating Voltage (V) : 100
Housing Features
- Centerline (Pitch) : 5.08 MM [.2 INCH ]
Mechanical Attachment
- Connector Mounting Type : Board Mount
Operation/Application
- Circuit Application : Power & Signal
Product Type Features
- Card Edge Type : HD+
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Board-to-Board
Termination Features
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
