Configuration Features Board-to-Board Configuration : Orthogonal Number of Positions : 56 Number of Rows : 2 PCB Mount Orientation : Perpendicular Right Angle
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1.1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .076 MICM [3 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Housing Features Centerline (Pitch) : .6 MM [.023 INCH ]
Industry Standards Industry Standard : EDSFF, Gen-Z
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Mates With : PCB Edge Card Internal I/O Connector Type : TE Sliver Sealable : No Shell : Without
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
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Description
Configuration Features Board-to-Board Configuration : Orthogonal Number of Positions : 56 Number of Rows : 2 PCB Mount Orientation : Perpendicular Right Angle
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1.1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .076 MICM [3 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Housing Features Centerline (Pitch) : .6 MM [.023 INCH ]
Industry Standards Industry Standard : EDSFF, Gen-Z
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Mates With : PCB Edge Card Internal I/O Connector Type : TE Sliver Sealable : No Shell : Without
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
Configuration Features Board-to-Board Configuration : Orthogonal Number of Positions : 56 Number of Rows : 2 PCB Mount Orientation : Perpendicular Right Angle
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1.1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .076 MICM [3 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Housing Features Centerline (Pitch) : .6 MM [.023 INCH ]
Industry Standards Industry Standard : EDSFF, Gen-Z
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Mates With : PCB Edge Card Internal I/O Connector Type : TE Sliver Sealable : No Shell : Without
Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
Configuration Features
Board-to-Board Configuration : Orthogonal
Number of Positions : 56
Number of Rows : 2
PCB Mount Orientation : Perpendicular Right Angle
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : 1.1
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .076 MICM [3 MICIN ]
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Tin
Housing Features
Centerline (Pitch) : .6 MM [.023 INCH ]
Industry Standards
Industry Standard : EDSFF, Gen-Z
Mechanical Attachment
Connector Mounting Type : Board Mount
Operation/Application
Circuit Application : Signal
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector Mates With : PCB Edge Card
Internal I/O Connector Type : TE Sliver
Sealable : No
Shell : Without
Termination Features
Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Usage Conditions
Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
