Configuration Features Number of Positions : 168 Number of Rows : 2 PCB Mount Orientation : Vertical
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .381 MICM [15 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Housing Features Centerline (Pitch) : .6 MM [.023 INCH ]
Industry Standards Industry Standard : OCP NIC 3.0, Gen-Z
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Mates With : PCB Edge Card Internal I/O Connector Type : Sliver for SFF-TA-1002
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
TE Connectivity
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Description
Configuration Features Number of Positions : 168 Number of Rows : 2 PCB Mount Orientation : Vertical
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .381 MICM [15 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Housing Features Centerline (Pitch) : .6 MM [.023 INCH ]
Industry Standards Industry Standard : OCP NIC 3.0, Gen-Z
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Mates With : PCB Edge Card Internal I/O Connector Type : Sliver for SFF-TA-1002
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
Configuration Features Number of Positions : 168 Number of Rows : 2 PCB Mount Orientation : Vertical
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .381 MICM [15 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Housing Features Centerline (Pitch) : .6 MM [.023 INCH ]
Industry Standards Industry Standard : OCP NIC 3.0, Gen-Z
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Mates With : PCB Edge Card Internal I/O Connector Type : Sliver for SFF-TA-1002
Termination Features Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
Configuration Features
Number of Positions : 168
Number of Rows : 2
PCB Mount Orientation : Vertical
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : 1.1
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .381 MICM [15 MICIN ]
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Tin
Housing Features
Centerline (Pitch) : .6 MM [.023 INCH ]
Industry Standards
Industry Standard : OCP NIC 3.0, Gen-Z
Mechanical Attachment
Connector Mounting Type : Board Mount
Operation/Application
Circuit Application : Signal
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector Mates With : PCB Edge Card
Internal I/O Connector Type : Sliver for SFF-TA-1002
Termination Features
Termination Method to PCB : Surface Mount
Usage Conditions
Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
