Configuration Features Number of Dual Positions : 5 Number of Positions : 34 Number of Power Positions : 10 Number of Signal Positions : 24
Contact Features Contact Current Rating (Max) (AMP) : 62.5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Type : Socket
Electrical Characteristics Operating Voltage (VAC) : 250 Operating Voltage (VDC) : 60 Operating Voltage (V) : 250
Housing Features Centerline (Pitch) : 8.24 MM [.324 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power & Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector & Housing Type : Receptacle Connector System : Board-to-Board
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range (DEGC) : -40 - 125
Configuration Features
- Number of Dual Positions : 5
- Number of Positions : 34
- Number of Power Positions : 10
- Number of Signal Positions : 24
Contact Features
- Contact Current Rating (Max) (AMP) : 62.5
- Contact Mating Area Plating Material : Gold
- Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
- Contact Type : Socket
Electrical Characteristics
- Operating Voltage (VAC) : 250
- Operating Voltage (VDC) : 60
- Operating Voltage (V) : 250
Housing Features
- Centerline (Pitch) : 8.24 MM [.324 INCH ]
Mechanical Attachment
- Connector Mounting Type : Board Mount
Operation/Application
- Circuit Application : Power & Signal
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector & Housing Type : Receptacle
- Connector System : Board-to-Board
Termination Features
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature Range (DEGC) : -40 - 125
