TE Connectivity Headers & Wire Housings 2315744-4

Description
4P, MICRO MNL,RCPT HSG, DUAL ROW, V0 GW
  • Headers & Wire Housings - 2315744-4 - Powell Electronics, Inc.
    Powell Electronics, Inc.
Request a Quote
Description
4P, MICRO MNL,RCPT HSG, DUAL ROW, V0 GW
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Headers & Wire Housings - 2315744-4 - Powell Electronics, Inc.
Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
2315744-4
Headers & Wire Housings 2315744-4
4P, MICRO MNL,RCPT HSG, DUAL ROW, V0 GW

4P, MICRO MNL,RCPT HSG, DUAL ROW, V0 GW

Buy Now
Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
2315744-4
Headers & Wire Housings 2315744-4
Headers & Wire Housings

Headers & Wire Housings

Buy Now

Technical Specifications

  Powell Electronics, Inc.
Product Category IC Interconnect Components
Product Number 2315744-4
Product Name Headers & Wire Housings
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Related Documents

Similar Products

DDR4 TH - 10153520-2203013LF - Amphenol Communications Solutions
Amphenol Communications Solutions
DDR4 TH
10153520-2203013LF
Specs
Product Type IC Socket
Mounting Through-Hole
View Details
718 Series CSP/BGA/QFN Devices Lidded - - Sensata Technologies
Sensata Technologies
718 Series CSP/BGA/QFN Devices Lidded
Specs
Product Type IC Socket
Contact Resistance 350 milliohms
Operating Temperature 125 C (257 F)
View Details
Micro SIM Card PCB Mount Socket - 80440GIH-061T-120L - Rego Electronics Inc.
Rego Electronics Inc.
Micro SIM Card PCB Mount Socket
80440GIH-061T-120L
Specs
Product Type IC Socket
Features Push-Push w/Switch
Number of Contacts 6
View Details
Thermal Management Lid Capabilities: IC Test Solutions - - Molex Signal Tech Industrial Ltd.
Molex Signal Tech Industrial Ltd.
Thermal Management Lid Capabilities: IC Test Solutions
Specs
Product Type IC Socket
Socket Type Test
View Details