TE Connectivity High Speed Backplane Connectors 2313237-1

Description
Configuration Features Backplane Architecture : Traditional Backplane Card Slot Centerline : 20.3 MM  [.8 INCH ] Guide Location : Unguided Number of Columns : 16 Number of Ground Positions : 31 Number of Pairs : 20 Number of Positions : 112 Number of Power Positions : 6 Number of Rows : 7 Number of Signal Positions : 20 PCB Mount Orientation : Right Angle Contact Features Contact Current Rating (Max) (AMP) : 1 Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Housing Material : Liquid Crystal Polymer (LCP) GF Number of Shrouded Sides : 2 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Keyed Operation/Applicatio n Circuit Application : Power & Signal Product Type Features Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Unshrouded Signal Arrangement : Differential Signaling & Single Ended Signal Characteristics Differential Impedance (OHM) : 100 Number of Differential Pairs per Column : 2 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
  • High Speed Backplane Connectors - 2313237-1 - TE Connectivity
    TE Connectivity
  • Backplane Connectors - 2313237-1 - Powell Electronics, Inc.
    Powell Electronics, Inc.
  • Connectors Board to Board, Bkplane, High Spd Modulr/Stckable - 2313237-1 - Heilind Electronics, Inc.
    Heilind Electronics, Inc.
  • Connector Rohs Compliant Te Connectivity - 28AH1664 - Newark, An Avnet Company
    Newark, An Avnet Company
Request a Quote Datasheet
Description
Configuration Features Backplane Architecture : Traditional Backplane Card Slot Centerline : 20.3 MM  [.8 INCH ] Guide Location : Unguided Number of Columns : 16 Number of Ground Positions : 31 Number of Pairs : 20 Number of Positions : 112 Number of Power Positions : 6 Number of Rows : 7 Number of Signal Positions : 20 PCB Mount Orientation : Right Angle Contact Features Contact Current Rating (Max) (AMP) : 1 Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Housing Material : Liquid Crystal Polymer (LCP) GF Number of Shrouded Sides : 2 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Keyed Operation/Applicatio n Circuit Application : Power & Signal Product Type Features Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Unshrouded Signal Arrangement : Differential Signaling & Single Ended Signal Characteristics Differential Impedance (OHM) : 100 Number of Differential Pairs per Column : 2 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
High Speed Backplane Connectors - 2313237-1 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
High Speed Backplane Connectors
2313237-1
High Speed Backplane Connectors 2313237-1
Configuration Features Backplane Architecture : Traditional Backplane Card Slot Centerline : 20.3 MM  [.8 INCH ] Guide Location : Unguided Number of Columns : 16 Number of Ground Positions : 31 Number of Pairs : 20 Number of Positions : 112 Number of Power Positions : 6 Number of Rows : 7 Number of Signal Positions : 20 PCB Mount Orientation : Right Angle Contact Features Contact Current Rating (Max) (AMP) : 1 Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Housing Material : Liquid Crystal Polymer (LCP) GF Number of Shrouded Sides : 2 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Keyed Operation/Applicatio n Circuit Application : Power & Signal Product Type Features Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Unshrouded Signal Arrangement : Differential Signaling & Single Ended Signal Characteristics Differential Impedance (OHM) : 100 Number of Differential Pairs per Column : 2 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]

Configuration Features


  • Backplane Architecture : Traditional Backplane
  • Card Slot Centerline : 20.3 MM  [.8 INCH ]
  • Guide Location : Unguided
  • Number of Columns : 16
  • Number of Ground Positions : 31
  • Number of Pairs : 20
  • Number of Positions : 112
  • Number of Power Positions : 6
  • Number of Rows : 7
  • Number of Signal Positions : 20
  • PCB Mount Orientation : Right Angle

Contact Features


  • Contact Current Rating (Max) (AMP) : 1

Dimensions


  • Row-to-Row Spacing : 1.35 MM  [.053 INCH ]

Housing Features


  • Centerline (Pitch) : 1.8 MM  [.071 INCH ]
  • Housing Material : Liquid Crystal Polymer (LCP) GF
  • Number of Shrouded Sides : 2

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : With
  • Mating Alignment Type : Keyed

Operation/Application


  • Circuit Application : Power & Signal

Product Type Features


  • Compatible with PCB Type : Daughtercard
  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • PCB Connector Type : PCB Mount Header
  • Shroud Style : Unshrouded
  • Signal Arrangement : Differential Signaling & Single Ended

Signal Characteristics


  • Differential Impedance (OHM) : 100
  • Number of Differential Pairs per Column : 2

Termination Features


  • Termination Method to PCB : Through Hole - Press-Fit

Usage Conditions


  • Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
Buy Now Datasheet
Backplane Connectors - 2313237-1 - Powell Electronics, Inc.
Powell Electronics, Inc.
Swedesboro, NJ, United States
Backplane Connectors
2313237-1
Backplane Connectors 2313237-1
RAPLUGASSY,MGRT3,POW ER,DP,SE,CENTER

RAPLUGASSY,MGRT3,POWER,DP,SE,CENTER

Buy Now
Powell Electronics, Inc.
Swedesboro, NJ, United States
Backplane Connectors
2313237-1
Backplane Connectors 2313237-1
Backplane Connectors

Backplane Connectors

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Connectors Board to Board, Bkplane, High Spd Modulr/Stckable - 2313237-1 - Heilind Electronics, Inc.
Heilind Electronics, Inc.
Wilmington, MA, United States
Connectors Board to Board, Bkplane, High Spd Modulr/Stckable
2313237-1
Connectors Board to Board, Bkplane, High Spd Modulr/Stckable 2313237-1
RAPLUGASSY,MGRT3,POW ER,DP,SE,C

RAPLUGASSY,MGRT3,POWER,DP,SE,C

Buy Now
Connector Rohs Compliant Te Connectivity - 28AH1664 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Connector Rohs Compliant Te Connectivity
28AH1664
Connector Rohs Compliant Te Connectivity 28AH1664
CONNECTOR ROHS COMPLIANT: NO

CONNECTOR ROHS COMPLIANT: NO

Supplier's Site Datasheet

Technical Specifications

  TE Connectivity Powell Electronics, Inc. Powell Electronics, Inc. Heilind Electronics, Inc. Newark, An Avnet Company
Product Category Board Mount Connectors Electrical Connectors Electrical Connectors Electrical Connectors Electrical Connectors
Product Number 2313237-1 2313237-1 2313237-1 2313237-1 28AH1664
Product Name High Speed Backplane Connectors Backplane Connectors Backplane Connectors Connectors Board to Board, Bkplane, High Spd Modulr/Stckable Connector Rohs Compliant Te Connectivity
Category Board to Board Connector
Termination Through Hole - Press-Fit
Mounting Board Mount
Current Rating 1.0 amps
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