TE Connectivity SO DIMM Sockets 2309410-1

Description
Body Features Connector Profile : Low Ejector Location : Both Ends Ejector Type : Locking Latch Material : High Temperature Thermoplastic Retention Post Location : Both Ends Retention Post Material : Copper Alloy Configuration Features Module Orientation : Right Angle Number of Keys : 1 Number of Positions : 260, 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Flash Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 8.2 MM  [.322 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.2 Housing Features Centerline (Pitch) : 3.3 MM , .5 MM  [.129 INCH , .02 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Reverse Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Peg Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Tape & Reel Packaging Quantity : 800 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Small Outline (SO) Signal Characteristics SGRAM Voltage (V) : 1.2 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
  • SO DIMM Sockets - 2309410-1 - TE Connectivity
    TE Connectivity
  • Connectors, Interconnects Memory Connectors Inline Module Sockets - Win Source Electronics
    Win Source Electronics
Request a Quote Datasheet
Description
Body Features Connector Profile : Low Ejector Location : Both Ends Ejector Type : Locking Latch Material : High Temperature Thermoplastic Retention Post Location : Both Ends Retention Post Material : Copper Alloy Configuration Features Module Orientation : Right Angle Number of Keys : 1 Number of Positions : 260, 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Flash Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 8.2 MM  [.322 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.2 Housing Features Centerline (Pitch) : 3.3 MM , .5 MM  [.129 INCH , .02 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Reverse Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Peg Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Tape & Reel Packaging Quantity : 800 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Small Outline (SO) Signal Characteristics SGRAM Voltage (V) : 1.2 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
SO DIMM Sockets - 2309410-1 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
SO DIMM Sockets
2309410-1
SO DIMM Sockets 2309410-1
Body Features Connector Profile : Low Ejector Location : Both Ends Ejector Type : Locking Latch Material : High Temperature Thermoplastic Retention Post Location : Both Ends Retention Post Material : Copper Alloy Configuration Features Module Orientation : Right Angle Number of Keys : 1 Number of Positions : 260, 200 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Flash Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash Dimensions Row-to-Row Spacing : 8.2 MM  [.322 INCH ] Stack Height : 5.2 MM  [.205 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.2 Housing Features Centerline (Pitch) : 3.3 MM , .5 MM  [.129 INCH , .02 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Reverse Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Peg Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Tape & Reel Packaging Quantity : 800 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Small Outline (SO) Signal Characteristics SGRAM Voltage (V) : 1.2 Termination Features Insertion Style : Cam-In Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]

Body Features


  • Connector Profile : Low
  • Ejector Location : Both Ends
  • Ejector Type : Locking
  • Latch Material : High Temperature Thermoplastic
  • Retention Post Location : Both Ends
  • Retention Post Material : Copper Alloy

Configuration Features


  • Module Orientation : Right Angle
  • Number of Keys : 1
  • Number of Positions : 260, 200
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : .5
  • Contact Mating Area Plating Material : Gold Flash
  • Contact Underplating Material : Nickel
  • Memory Socket Type : Memory Card
  • PCB Contact Termination Area Plating Material : Gold Flash

Dimensions


  • Row-to-Row Spacing : 8.2 MM  [.322 INCH ]
  • Stack Height : 5.2 MM  [.205 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 1.2

Housing Features


  • Centerline (Pitch) : 3.3 MM , .5 MM  [.129 INCH , .02 INCH ]
  • Housing Color : Black
  • Housing Material : High Temperature Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment Type : Reverse Keying
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Solder Peg

Operation/Application


  • Circuit Application : Power

Packaging Features


  • Packaging Method : Tape & Reel
  • Packaging Quantity : 800

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Cable-to-Board
  • DRAM Type : Small Outline (SO)

Signal Characteristics


  • SGRAM Voltage (V) : 1.2

Termination Features


  • Insertion Style : Cam-In
  • Termination Method to PCB : Surface Mount

Usage Conditions


  • Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]
Buy Now
Connectors, Interconnects Memory Connectors Inline Module Sockets - - Win Source Electronics
Win Source Electronics
Laguna Hills, CA, United States
Connectors, Interconnects Memory Connectors Inline Module Sockets
Connectors, Interconnects Memory Connectors Inline Module Sockets
Manufacturer: TE Connectivity AMP Connectors Category: Connectors, Interconnects Memory Connectors Inline Module Sockets Series: AdvancedMC Features: Board Guide, Latches Package: Tape & Reel (TR) Cut Tape (CT) Memory Type: DDR4 SDRAM Mounting Type: Surface Mount Alternative Parts (Cross-Reference): Cross Product Status: Active Insertion Angle: 25° Angle Connector Style: SODIMM

Manufacturer: TE Connectivity AMP Connectors
Category: Connectors, Interconnects Memory Connectors Inline Module Sockets
Series: AdvancedMC
Features: Board Guide, Latches
Package: Tape & Reel (TR) Cut Tape (CT)
Memory Type: DDR4 SDRAM
Mounting Type: Surface Mount
Alternative Parts (Cross-Reference): Cross
Product Status: Active
Insertion Angle: 25° Angle
Connector Style: SODIMM

Buy Now Datasheet

Technical Specifications

  TE Connectivity Win Source Electronics
Product Category IC Interconnect Components IC Interconnect Components
Product Number 2309410-1
Product Name SO DIMM Sockets Connectors, Interconnects Memory Connectors Inline Module Sockets
Product Type IC Socket IC Headers
Socket Type DIMM
Mounting SMT; Board Mount Surface Mount
Voltage Rating 1.2 volts
Current Rating 0.5000 amps
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