TE Connectivity DIMM Sockets 2308107-1

Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Material : High Temperature Thermoplastic Ejector Material Color : Black Ejector Type : Standard Latch Color : Black Latch Material : High Temperature Thermoplastic Module Key Type : Offset Right PCB Retention Feature Material : Stainless Steel Configuration Features Module Orientation : Vertical Number of Keys : 1 Number of Positions : 288 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .75 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ] Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin Socket Style : DIMM Electrical Characteristics DRAM Voltage (V) : 1.2 Housing Features Centerline (Pitch) : .85 MM  [.033 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Alignment Type : Offset Right PCB Mount Retention : With PCB Mount Retention Type : Boardlock Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Bus Bar DRAM Type : Double Data Rate (DDR) 4 Termination Features Insertion Style : Direct Insert Termination Method to PCB : Through Hole - Solder Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
  • DIMM Sockets - 2308107-1 - TE Connectivity
    TE Connectivity
  • Connectors, Interconnects Memory Connectors Inline Module Sockets - Win Source Electronics
    Win Source Electronics
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Description
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Material : High Temperature Thermoplastic Ejector Material Color : Black Ejector Type : Standard Latch Color : Black Latch Material : High Temperature Thermoplastic Module Key Type : Offset Right PCB Retention Feature Material : Stainless Steel Configuration Features Module Orientation : Vertical Number of Keys : 1 Number of Positions : 288 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .75 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ] Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin Socket Style : DIMM Electrical Characteristics DRAM Voltage (V) : 1.2 Housing Features Centerline (Pitch) : .85 MM  [.033 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Alignment Type : Offset Right PCB Mount Retention : With PCB Mount Retention Type : Boardlock Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Bus Bar DRAM Type : Double Data Rate (DDR) 4 Termination Features Insertion Style : Direct Insert Termination Method to PCB : Through Hole - Solder Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
DIMM Sockets - 2308107-1 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
DIMM Sockets
2308107-1
DIMM Sockets 2308107-1
Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Material : High Temperature Thermoplastic Ejector Material Color : Black Ejector Type : Standard Latch Color : Black Latch Material : High Temperature Thermoplastic Module Key Type : Offset Right PCB Retention Feature Material : Stainless Steel Configuration Features Module Orientation : Vertical Number of Keys : 1 Number of Positions : 288 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .75 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ] Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin Socket Style : DIMM Electrical Characteristics DRAM Voltage (V) : 1.2 Housing Features Centerline (Pitch) : .85 MM  [.033 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Alignment Type : Offset Right PCB Mount Retention : With PCB Mount Retention Type : Boardlock Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Bus Bar DRAM Type : Double Data Rate (DDR) 4 Termination Features Insertion Style : Direct Insert Termination Method to PCB : Through Hole - Solder Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]

Body Features


  • Connector Profile : Standard
  • Ejector Location : Both Ends
  • Ejector Material : High Temperature Thermoplastic
  • Ejector Material Color : Black
  • Ejector Type : Standard
  • Latch Color : Black
  • Latch Material : High Temperature Thermoplastic
  • Module Key Type : Offset Right
  • PCB Retention Feature Material : Stainless Steel

Configuration Features


  • Module Orientation : Vertical
  • Number of Keys : 1
  • Number of Positions : 288
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : .75
  • Contact Mating Area Plating Material : Gold (Au)
  • Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ]
  • Contact Underplating Material : Nickel
  • Memory Socket Type : Memory Card
  • PCB Contact Termination Area Plating Material : Tin
  • Socket Style : DIMM

Electrical Characteristics


  • DRAM Voltage (V) : 1.2

Housing Features


  • Centerline (Pitch) : .85 MM  [.033 INCH ]
  • Housing Color : Black
  • Housing Material : High Temperature Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : Without
  • Mating Alignment Type : Offset Right
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Boardlock

Operation/Application


  • Circuit Application : Signal

Packaging Features


  • Packaging Method : Tray

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Bus Bar
  • DRAM Type : Double Data Rate (DDR) 4

Termination Features


  • Insertion Style : Direct Insert
  • Termination Method to PCB : Through Hole - Solder

Usage Conditions


  • Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
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Connectors, Interconnects Memory Connectors Inline Module Sockets - - Win Source Electronics
Win Source Electronics
Laguna Hills, CA, United States
Connectors, Interconnects Memory Connectors Inline Module Sockets
Connectors, Interconnects Memory Connectors Inline Module Sockets
Manufacturer: TE Connectivity AMP Connectors Category: Connectors, Interconnects Memory Connectors Inline Module Sockets Number of Positions: 288 Features: Board Lock, Latches Package: Tray Memory Type: DDR4 SDRAM Standards: MO-309 Mounting Type: Through Hole Alternative Parts (Cross-Reference): Cross Product Status: Active Connector Style: DIMM

Manufacturer: TE Connectivity AMP Connectors
Category: Connectors, Interconnects Memory Connectors Inline Module Sockets
Number of Positions: 288
Features: Board Lock, Latches
Package: Tray
Memory Type: DDR4 SDRAM
Standards: MO-309
Mounting Type: Through Hole
Alternative Parts (Cross-Reference): Cross
Product Status: Active
Connector Style: DIMM

Buy Now Datasheet

Technical Specifications

  TE Connectivity Win Source Electronics
Product Category IC Interconnect Components IC Interconnect Components
Product Number 2308107-1
Product Name DIMM Sockets Connectors, Interconnects Memory Connectors Inline Module Sockets
Product Type IC Socket IC Headers
Socket Type DIMM
Mounting Through-Hole; Board Mount Through-Hole; Through Hole
Voltage Rating 1.2 volts
Current Rating 0.7500 amps
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