TE Connectivity High Speed Backplane Connectors 2302790-3

Body Features Primary Product Color : Black Configuration Features Backplane Architecture : Traditional Backplane Number of Columns : 16 Number of Positions : 144 Number of Rows : 9 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Dimensions Row-to-Row Spacing (MM) : 1.8 Housing Features Centerline (Pitch) (MM) : 1.8 Housing Material : LCP - GF (Liquid Crystal Polymer) Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Power, Signal & High Speed Data Packaging Features Packaging Method : Tube Product Type Features Applied to Printed Circuit Board Type : Backplane Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Receptacle Shroud Style : Unshrouded Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]