TE Connectivity High Speed Backplane Connectors 2302321-2

Description
Configuration Features Backplane Architecture : Traditional Backplane Card Slot Centerline : 20.3 MM  [.8 INCH ] Guide Location : Unguided Number of Columns : 8 Number of Ground Positions : 20 Number of Pairs : 16 Number of Positions : 56 Number of Rows : 7 Number of Signal Positions : 4 PCB Mount Orientation : Right Angle Contact Features Contact Current Rating (Max) (AMP) : 1 Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Housing Material : Liquid Crystal Polymer (LCP) GF Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Keyed Operation/Applicatio n Circuit Application : Signal Product Type Features Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Unshrouded Signal Arrangement : Differential Signal Characteristics Differential Impedance (OHM) : 100 Number of Differential Pairs per Column : 2 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
  • High Speed Backplane Connectors - 2302321-2 - TE Connectivity
    TE Connectivity
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Description
Configuration Features Backplane Architecture : Traditional Backplane Card Slot Centerline : 20.3 MM  [.8 INCH ] Guide Location : Unguided Number of Columns : 8 Number of Ground Positions : 20 Number of Pairs : 16 Number of Positions : 56 Number of Rows : 7 Number of Signal Positions : 4 PCB Mount Orientation : Right Angle Contact Features Contact Current Rating (Max) (AMP) : 1 Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Housing Material : Liquid Crystal Polymer (LCP) GF Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Keyed Operation/Applicatio n Circuit Application : Signal Product Type Features Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Unshrouded Signal Arrangement : Differential Signal Characteristics Differential Impedance (OHM) : 100 Number of Differential Pairs per Column : 2 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Suppliers

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Product
Description
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High Speed Backplane Connectors - 2302321-2 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
High Speed Backplane Connectors
2302321-2
High Speed Backplane Connectors 2302321-2
Configuration Features Backplane Architecture : Traditional Backplane Card Slot Centerline : 20.3 MM  [.8 INCH ] Guide Location : Unguided Number of Columns : 8 Number of Ground Positions : 20 Number of Pairs : 16 Number of Positions : 56 Number of Rows : 7 Number of Signal Positions : 4 PCB Mount Orientation : Right Angle Contact Features Contact Current Rating (Max) (AMP) : 1 Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Housing Material : Liquid Crystal Polymer (LCP) GF Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Keyed Operation/Applicatio n Circuit Application : Signal Product Type Features Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Unshrouded Signal Arrangement : Differential Signal Characteristics Differential Impedance (OHM) : 100 Number of Differential Pairs per Column : 2 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]

Configuration Features


  • Backplane Architecture : Traditional Backplane
  • Card Slot Centerline : 20.3 MM  [.8 INCH ]
  • Guide Location : Unguided
  • Number of Columns : 8
  • Number of Ground Positions : 20
  • Number of Pairs : 16
  • Number of Positions : 56
  • Number of Rows : 7
  • Number of Signal Positions : 4
  • PCB Mount Orientation : Right Angle

Contact Features


  • Contact Current Rating (Max) (AMP) : 1

Dimensions


  • Row-to-Row Spacing : 1.35 MM  [.053 INCH ]

Housing Features


  • Centerline (Pitch) : 1.8 MM  [.071 INCH ]
  • Housing Material : Liquid Crystal Polymer (LCP) GF

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : With
  • Mating Alignment Type : Keyed

Operation/Application


  • Circuit Application : Signal

Product Type Features


  • Compatible with PCB Type : Daughtercard
  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • PCB Connector Type : PCB Mount Header
  • Shroud Style : Unshrouded
  • Signal Arrangement : Differential

Signal Characteristics


  • Differential Impedance (OHM) : 100
  • Number of Differential Pairs per Column : 2

Termination Features


  • Termination Method to PCB : Through Hole - Press-Fit

Usage Conditions


  • Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Technical Specifications

  TE Connectivity
Product Category Board Mount Connectors
Product Number 2302321-2
Product Name High Speed Backplane Connectors
Category Board to Board Connector
Termination Through Hole - Press-Fit
Mounting Board Mount
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