TE Connectivity High Speed Backplane Connectors 2302320-1

Configuration Features

• Backplane Architecture : Traditional Backplane
• Card Slot Centerline : 20.3 MM  [.8 INCH ]
• Guide Location : Unguided
• Number of Columns : 16
• Number of Ground Positions : 40
• Number of Pairs : 32
• Number of Positions : 112
• Number of Power Positions : 0
• Number of Rows : 7
• Number of Signal Positions : 8
• PCB Mount Orientation : Right Angle

Contact Features

• Contact Current Rating (Max) (AMP) : 1

Dimensions

• Row-to-Row Spacing : 1.35 MM  [.053 INCH ]

Housing Features

• Centerline (Pitch) : 1.8 MM  [.071 INCH ]
• Housing Material : Liquid Crystal Polymer (LCP) GF
• Number of Shrouded Sides : 2

Mechanical Attachment

• Connector Mounting Type : Board Mount
• Mating Alignment : With
• Mating Alignment Type : Keyed

Operation/Application

• Circuit Application : Signal

Product Type Features

• Compatible with PCB Type : Daughtercard
• Connector & Contact Terminates To : Printed Circuit Board
• Connector System : Board-to-Board
• PCB Connector Type : PCB Mount Header
• Shroud Style : Unshrouded
• Signal Arrangement : Differential

Signal Characteristics

• Differential Impedance (OHM) : 100
• Number of Differential Pairs per Column : 2

Termination Features

• Termination Method to PCB : Through Hole - Press-Fit

Usage Conditions

• Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]

RA ASSY, Cent RTM DP, MULTIGIG RT 2-S