Body Features Heat Sink Height (INCH) : .165 Heat Sink Height Class : PCI Heat Sink Style : Fin
Configuration Features Number of Ports : 1 Port Matrix Configuration : 1 x 1
Electrical Characteristics Data Rate (Max) (GBS) : 32
Operation/Applicatio
n Circuit Application : Signal Heat Sink Compatible : Yes Pluggable I/O Applications : zSFP+ Thermally Enhanced
Other EMI Containment Feature Type : Internal/External EMI Springs Included Lightpipe : No
Product Type Features Cage Type : Single Pluggable Form Factor : zSFP+ Pluggable I/O Product Type : Cage Assembly Sealable : No Thermal Accessory Type Included : Heat Sink
Termination Features Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features
- Heat Sink Height (INCH) : .165
- Heat Sink Height Class : PCI
- Heat Sink Style : Fin
Configuration Features
- Number of Ports : 1
- Port Matrix Configuration : 1 x 1
Electrical Characteristics
- Data Rate (Max) (GBS) : 32
Operation/Application
- Circuit Application : Signal
- Heat Sink Compatible : Yes
- Pluggable I/O Applications : zSFP+ Thermally Enhanced
Other
- EMI Containment Feature Type : Internal/External EMI Springs
- Included Lightpipe : No
Product Type Features
- Cage Type : Single
- Pluggable Form Factor : zSFP+
- Pluggable I/O Product Type : Cage Assembly
- Sealable : No
- Thermal Accessory Type Included : Heat Sink
Termination Features
- Termination Method to PCB : Through Hole - Press-Fit
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
