TE Connectivity Data Connectivity Headers 2293409-1

Description
Body Features Body Material : Zinc Alloy PCB Retention Feature Plating Material : Tin Configuration Features Number of Positions : 4 Number of Rows : 2 PCB Mount Orientation : Vertical Contact Features Center Contact : With Contact Current Rating (Max) (AMP) : 2.5 Contact Mating Area Plating Material : Gold (Au) Contact Type : Pin Mating Pin Diameter : .6 MM  [.02 INCH ] Outer Contact Plating Material : Tin (Sn) RF Connector Center Contact Plating Material : Gold (Au) Dimensions Connector Height : 13.37 MM  [.526 INCH ] Product Length : 9.2 MM  [.362 INCH ] Product Width : 8 MM  [.314 INCH ] Electrical Characteristics Impedance (OHM) : 100 Operating Voltage (VDC) : 60 Housing Features Centerline (Pitch) : 2 MM  [.07 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Mating Retention : Without PCB Mount Retention : With PCB Mount Retention Type : Solder Tail Operation/Applicatio n Assembly Process Feature : Board Standoff Circuit Application : Signal Operating Frequency Range (GHZ) : 0 - 3 Shielded : Yes Solder Process : Reflow Solder Capable Other Dielectric Material : PA GF Packaging Features Packaging Method : Reel Packaging Quantity : 270 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Mixed & Hybrid Connector : No Sealable : No Termination Features Termination Method to PCB : Through Hole - Solder Usage Conditions Operating Temperature (Max) : 105 DEGC  [212 DEGF ] Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]
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Description
Body Features Body Material : Zinc Alloy PCB Retention Feature Plating Material : Tin Configuration Features Number of Positions : 4 Number of Rows : 2 PCB Mount Orientation : Vertical Contact Features Center Contact : With Contact Current Rating (Max) (AMP) : 2.5 Contact Mating Area Plating Material : Gold (Au) Contact Type : Pin Mating Pin Diameter : .6 MM  [.02 INCH ] Outer Contact Plating Material : Tin (Sn) RF Connector Center Contact Plating Material : Gold (Au) Dimensions Connector Height : 13.37 MM  [.526 INCH ] Product Length : 9.2 MM  [.362 INCH ] Product Width : 8 MM  [.314 INCH ] Electrical Characteristics Impedance (OHM) : 100 Operating Voltage (VDC) : 60 Housing Features Centerline (Pitch) : 2 MM  [.07 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Mating Retention : Without PCB Mount Retention : With PCB Mount Retention Type : Solder Tail Operation/Applicatio n Assembly Process Feature : Board Standoff Circuit Application : Signal Operating Frequency Range (GHZ) : 0 - 3 Shielded : Yes Solder Process : Reflow Solder Capable Other Dielectric Material : PA GF Packaging Features Packaging Method : Reel Packaging Quantity : 270 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Mixed & Hybrid Connector : No Sealable : No Termination Features Termination Method to PCB : Through Hole - Solder Usage Conditions Operating Temperature (Max) : 105 DEGC  [212 DEGF ] Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]
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Product
Description
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Data Connectivity Headers - 2293409-1 - TE Connectivity
Berwyn, PA, United States
Data Connectivity Headers
2293409-1
Data Connectivity Headers 2293409-1
Body Features Body Material : Zinc Alloy PCB Retention Feature Plating Material : Tin Configuration Features Number of Positions : 4 Number of Rows : 2 PCB Mount Orientation : Vertical Contact Features Center Contact : With Contact Current Rating (Max) (AMP) : 2.5 Contact Mating Area Plating Material : Gold (Au) Contact Type : Pin Mating Pin Diameter : .6 MM  [.02 INCH ] Outer Contact Plating Material : Tin (Sn) RF Connector Center Contact Plating Material : Gold (Au) Dimensions Connector Height : 13.37 MM  [.526 INCH ] Product Length : 9.2 MM  [.362 INCH ] Product Width : 8 MM  [.314 INCH ] Electrical Characteristics Impedance (OHM) : 100 Operating Voltage (VDC) : 60 Housing Features Centerline (Pitch) : 2 MM  [.07 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Mating Retention : Without PCB Mount Retention : With PCB Mount Retention Type : Solder Tail Operation/Applicatio n Assembly Process Feature : Board Standoff Circuit Application : Signal Operating Frequency Range (GHZ) : 0 - 3 Shielded : Yes Solder Process : Reflow Solder Capable Other Dielectric Material : PA GF Packaging Features Packaging Method : Reel Packaging Quantity : 270 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Mixed & Hybrid Connector : No Sealable : No Termination Features Termination Method to PCB : Through Hole - Solder Usage Conditions Operating Temperature (Max) : 105 DEGC  [212 DEGF ] Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]

Body Features


  • Body Material : Zinc Alloy
  • PCB Retention Feature Plating Material : Tin

Configuration Features


  • Number of Positions : 4
  • Number of Rows : 2
  • PCB Mount Orientation : Vertical

Contact Features


  • Center Contact : With
  • Contact Current Rating (Max) (AMP) : 2.5
  • Contact Mating Area Plating Material : Gold (Au)
  • Contact Type : Pin
  • Mating Pin Diameter : .6 MM  [.02 INCH ]
  • Outer Contact Plating Material : Tin (Sn)
  • RF Connector Center Contact Plating Material : Gold (Au)

Dimensions


  • Connector Height : 13.37 MM  [.526 INCH ]
  • Product Length : 9.2 MM  [.362 INCH ]
  • Product Width : 8 MM  [.314 INCH ]

Electrical Characteristics


  • Impedance (OHM) : 100
  • Operating Voltage (VDC) : 60

Housing Features


  • Centerline (Pitch) : 2 MM  [.07 INCH ]

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Retention : Without
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Solder Tail

Operation/Application


  • Assembly Process Feature : Board Standoff
  • Circuit Application : Signal
  • Operating Frequency Range (GHZ) : 0 - 3
  • Shielded : Yes
  • Solder Process : Reflow Solder Capable

Other


  • Dielectric Material : PA GF

Packaging Features


  • Packaging Method : Reel
  • Packaging Quantity : 270

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Wire-to-Board
  • Mixed & Hybrid Connector : No
  • Sealable : No

Termination Features


  • Termination Method to PCB : Through Hole - Solder

Usage Conditions


  • Operating Temperature (Max) : 105 DEGC  [212 DEGF ]
  • Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]
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Technical Specifications

  TE Connectivity
Product Category Electrical Connectors
Product Number 2293409-1
Product Name Data Connectivity Headers
Connector Type Wire to Board Connector
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