TE Connectivity LGA Sockets 2287402-1

Body Features Frame Style : Square Plating Material : Gold Plating Thickness (MICIN) : 15 Configuration Features Grid Spacing : .914 x .914 MM  [.036 x .036 INCH ] Number of Positions : 1151 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 IC Socket Type : LGA 1151 Housing Features Centerline (Pitch) : .91 MM  [.036 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Heat Sink Attachment : Without PCB Mounting Style : Surface Mount Solder Ball Operation/Applicatio n Circuit Application : Signal Other Comment : Lead-Free Solderball Packaging Features Packaging Method : Tray Tray Color : Gray Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Product Type : Socket Usage Conditions Operating Temperature Range : -25 - 100 DEGC  [-13 - 212 DEGF ]