TE Connectivity High Speed Backplane Connectors 2286123-1

Description
Configuration Features Backplane Architecture : Traditional Backplane Guide Location : Left Number of Columns : 8 Number of Positions : 56 Number of Rows : 7 PCB Mount Orientation : Right Angle Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Electrical Characteristics Impedance (OHM) : 50 Operating Voltage (VAC) : 50 Operating Voltage (VDC) : 50 Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Guide Hardware : With Mating Alignment : With Mating Alignment Type : Guide Pin Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Tube Product Type Features Backplane Module Type : Half Left Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Partially Shrouded Signal Characteristics Differential Impedance (OHM) : 100 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Description
Configuration Features Backplane Architecture : Traditional Backplane Guide Location : Left Number of Columns : 8 Number of Positions : 56 Number of Rows : 7 PCB Mount Orientation : Right Angle Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Electrical Characteristics Impedance (OHM) : 50 Operating Voltage (VAC) : 50 Operating Voltage (VDC) : 50 Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Guide Hardware : With Mating Alignment : With Mating Alignment Type : Guide Pin Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Tube Product Type Features Backplane Module Type : Half Left Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Partially Shrouded Signal Characteristics Differential Impedance (OHM) : 100 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
High Speed Backplane Connectors - 2286123-1 - TE Connectivity
Berwyn, PA, United States
High Speed Backplane Connectors
2286123-1
High Speed Backplane Connectors 2286123-1
Configuration Features Backplane Architecture : Traditional Backplane Guide Location : Left Number of Columns : 8 Number of Positions : 56 Number of Rows : 7 PCB Mount Orientation : Right Angle Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Electrical Characteristics Impedance (OHM) : 50 Operating Voltage (VAC) : 50 Operating Voltage (VDC) : 50 Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Guide Hardware : With Mating Alignment : With Mating Alignment Type : Guide Pin Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Tube Product Type Features Backplane Module Type : Half Left Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Partially Shrouded Signal Characteristics Differential Impedance (OHM) : 100 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]

Configuration Features


  • Backplane Architecture : Traditional Backplane
  • Guide Location : Left
  • Number of Columns : 8
  • Number of Positions : 56
  • Number of Rows : 7
  • PCB Mount Orientation : Right Angle

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : 1
  • Contact Mating Area Plating Material : Gold (Au)
  • Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ]
  • Contact Underplating Material : Nickel
  • PCB Contact Termination Area Plating Material : Tin-Lead
  • PCB Contact Termination Area Plating Material Thickness : 1.27 MICM  [50 MICIN ]

Dimensions


  • Row-to-Row Spacing : 1.35 MM  [.053 INCH ]

Electrical Characteristics


  • Impedance (OHM) : 50
  • Operating Voltage (VAC) : 50
  • Operating Voltage (VDC) : 50

Housing Features


  • Centerline (Pitch) : 1.8 MM  [.071 INCH ]

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Guide Hardware : With
  • Mating Alignment : With
  • Mating Alignment Type : Guide Pin

Operation/Application


  • Circuit Application : Power & Signal

Packaging Features


  • Packaging Method : Tube

Product Type Features


  • Backplane Module Type : Half Left
  • Compatible with PCB Type : Daughtercard
  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • PCB Connector Type : PCB Mount Header
  • Shroud Style : Partially Shrouded

Signal Characteristics


  • Differential Impedance (OHM) : 100

Termination Features


  • Termination Method to PCB : Through Hole - Press-Fit

Usage Conditions


  • Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
Buy Now
Backplane Connectors - 2286123-1 - Powell Electronics, Inc.
Swedesboro, NJ, United States
Backplane Connectors
2286123-1
Backplane Connectors 2286123-1
MULTIGIG RT2-R,DC,SPACE VPX-MODULE 8

MULTIGIG RT2-R,DC,SPACE VPX-MODULE 8

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Multigig Rt2-R,dc,space Vpx-Module 8 Te Connectivity - 25AJ3936 - Newark, An Avnet Company
Chicago, IL, United States
Multigig Rt2-R,dc,space Vpx-Module 8 Te Connectivity
25AJ3936
Multigig Rt2-R,dc,space Vpx-Module 8 Te Connectivity 25AJ3936
MULTIGIG RT2-R,DC,SPACE VPX-MODULE 8

MULTIGIG RT2-R,DC,SPACE VPX-MODULE 8

Supplier's Site
Backplane Connectors - Specialized - 2286123-1 - Lingto Electronic Limited
Shenzhen, China
Backplane Connectors - Specialized
2286123-1
Backplane Connectors - Specialized 2286123-1
MULTIGIG RT2-R,DC,SPACE VPX-MODU

MULTIGIG RT2-R,DC,SPACE VPX-MODU

Supplier's Site Datasheet

Technical Specifications

  TE Connectivity Powell Electronics, Inc. Newark, An Avnet Company Lingto Electronic Limited
Product Category Board Mount Connectors Electrical Connectors Electrical Connectors Electrical Connectors
Product Number 2286123-1 2286123-1 25AJ3936 2286123-1
Product Name High Speed Backplane Connectors Backplane Connectors Multigig Rt2-R,dc,space Vpx-Module 8 Te Connectivity Backplane Connectors - Specialized
Category Board to Board Connector
Termination Through Hole - Press-Fit
Mounting Board Mount
Voltage Rating 50 volts
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