TE Connectivity High Speed Backplane Connectors 2286121-3

Description
Body Features Primary Product Color : Black Configuration Features Backplane Architecture : Traditional Backplane Number of Columns : 16 Number of Positions : 112 Number of Rows : 7 PCB Mount Orientation : Right Angle Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Dimensions Row-to-Row Spacing (MM) : 1.8 Housing Features Centerline (Pitch) (MM) : 1.8 Housing Material : LCP - GF (Liquid Crystal Polymer) Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Power, Signal & High Speed Data Packaging Features Packaging Method : Tube Product Type Features Applied to Printed Circuit Board Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Description
Body Features Primary Product Color : Black Configuration Features Backplane Architecture : Traditional Backplane Number of Columns : 16 Number of Positions : 112 Number of Rows : 7 PCB Mount Orientation : Right Angle Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Dimensions Row-to-Row Spacing (MM) : 1.8 Housing Features Centerline (Pitch) (MM) : 1.8 Housing Material : LCP - GF (Liquid Crystal Polymer) Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Power, Signal & High Speed Data Packaging Features Packaging Method : Tube Product Type Features Applied to Printed Circuit Board Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Suppliers

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Product
Description
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High Speed Backplane Connectors - 2286121-3 - TE Connectivity
Berwyn, PA, United States
High Speed Backplane Connectors
2286121-3
High Speed Backplane Connectors 2286121-3
Body Features Primary Product Color : Black Configuration Features Backplane Architecture : Traditional Backplane Number of Columns : 16 Number of Positions : 112 Number of Rows : 7 PCB Mount Orientation : Right Angle Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin-Lead PCB Contact Termination Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Dimensions Row-to-Row Spacing (MM) : 1.8 Housing Features Centerline (Pitch) (MM) : 1.8 Housing Material : LCP - GF (Liquid Crystal Polymer) Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Power, Signal & High Speed Data Packaging Features Packaging Method : Tube Product Type Features Applied to Printed Circuit Board Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Header Termination Features Termination Method to Printed Circuit Board : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]

Body Features


  • Primary Product Color : Black

Configuration Features


  • Backplane Architecture : Traditional Backplane
  • Number of Columns : 16
  • Number of Positions : 112
  • Number of Rows : 7
  • PCB Mount Orientation : Right Angle

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : 1
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ]
  • Contact Underplating Material : Nickel
  • PCB Contact Termination Area Plating Material : Tin-Lead
  • PCB Contact Termination Area Plating Material Thickness : 1.27 MICM  [50 MICIN ]

Dimensions


  • Row-to-Row Spacing (MM) : 1.8

Housing Features


  • Centerline (Pitch) (MM) : 1.8
  • Housing Material : LCP - GF (Liquid Crystal Polymer)

Mechanical Attachment


  • Connector Mounting Type : Board Mount

Operation/Application


  • Circuit Application : Power, Signal & High Speed Data

Packaging Features


  • Packaging Method : Tube

Product Type Features


  • Applied to Printed Circuit Board Type : Daughtercard
  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • PCB Connector Assembly Type : PCB Mount Header

Termination Features


  • Termination Method to Printed Circuit Board : Through Hole - Press-Fit

Usage Conditions


  • Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Technical Specifications

  TE Connectivity
Product Category Electrical Connectors
Product Number 2286121-3
Product Name High Speed Backplane Connectors
Connector Type Board to Board Connector
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