TE Connectivity High Speed Backplane Connectors 2286121-1

Description
Configuration Features Backplane Architecture : Traditional Backplane Guide Location : Left Number of Columns : 16 Number of Positions : 112 Number of Rows : 7 PCB Mount Orientation : Right Angle Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Contact Underplating Material : Nickel Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Electrical Characteristics Impedance (OHM) : 50 Operating Voltage (VAC) : 50 Operating Voltage (VDC) : 50 Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Number of Shrouded Sides : 2 Mechanical Attachment Connector Mounting Type : Board Mount Guide Hardware : With Mating Alignment : With Mating Alignment Type : Guide Pin Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Tube Product Type Features Backplane Module Type : Center Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Fully Shrouded Signal Characteristics Differential Impedance (OHM) : 100 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
  • High Speed Backplane Connectors - 2286121-1 - TE Connectivity
    TE Connectivity
  • D-Sub Connector Assemblies - 17-2286121-1-ND - DigiKey
    DigiKey
  • Backplane Connectors - 2286121-1 - Powell Electronics, Inc.
    Powell Electronics, Inc.
  • Multigig Rt2-R, Dc, Space Vpx Module 16E Amp - Te Connectivity - 75AC7641 - Newark, An Avnet Company
    Newark, An Avnet Company
Request a Quote Datasheet
Description
Configuration Features Backplane Architecture : Traditional Backplane Guide Location : Left Number of Columns : 16 Number of Positions : 112 Number of Rows : 7 PCB Mount Orientation : Right Angle Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Contact Underplating Material : Nickel Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Electrical Characteristics Impedance (OHM) : 50 Operating Voltage (VAC) : 50 Operating Voltage (VDC) : 50 Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Number of Shrouded Sides : 2 Mechanical Attachment Connector Mounting Type : Board Mount Guide Hardware : With Mating Alignment : With Mating Alignment Type : Guide Pin Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Tube Product Type Features Backplane Module Type : Center Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Fully Shrouded Signal Characteristics Differential Impedance (OHM) : 100 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
High Speed Backplane Connectors - 2286121-1 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
High Speed Backplane Connectors
2286121-1
High Speed Backplane Connectors 2286121-1
Configuration Features Backplane Architecture : Traditional Backplane Guide Location : Left Number of Columns : 16 Number of Positions : 112 Number of Rows : 7 PCB Mount Orientation : Right Angle Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ] Contact Underplating Material : Nickel Dimensions Row-to-Row Spacing : 1.35 MM  [.053 INCH ] Electrical Characteristics Impedance (OHM) : 50 Operating Voltage (VAC) : 50 Operating Voltage (VDC) : 50 Housing Features Centerline (Pitch) : 1.8 MM  [.071 INCH ] Number of Shrouded Sides : 2 Mechanical Attachment Connector Mounting Type : Board Mount Guide Hardware : With Mating Alignment : With Mating Alignment Type : Guide Pin Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Tube Product Type Features Backplane Module Type : Center Compatible with PCB Type : Daughtercard Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header Shroud Style : Fully Shrouded Signal Characteristics Differential Impedance (OHM) : 100 Termination Features Termination Method to PCB : Through Hole - Press-Fit Usage Conditions Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]

Configuration Features


  • Backplane Architecture : Traditional Backplane
  • Guide Location : Left
  • Number of Columns : 16
  • Number of Positions : 112
  • Number of Rows : 7
  • PCB Mount Orientation : Right Angle

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : 1
  • Contact Mating Area Plating Material : Gold (Au)
  • Contact Mating Area Plating Material Thickness : 1.27 MICM  [50 MICIN ]
  • Contact Underplating Material : Nickel

Dimensions


  • Row-to-Row Spacing : 1.35 MM  [.053 INCH ]

Electrical Characteristics


  • Impedance (OHM) : 50
  • Operating Voltage (VAC) : 50
  • Operating Voltage (VDC) : 50

Housing Features


  • Centerline (Pitch) : 1.8 MM  [.071 INCH ]
  • Number of Shrouded Sides : 2

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Guide Hardware : With
  • Mating Alignment : With
  • Mating Alignment Type : Guide Pin

Operation/Application


  • Circuit Application : Power & Signal

Packaging Features


  • Packaging Method : Tube

Product Type Features


  • Backplane Module Type : Center
  • Compatible with PCB Type : Daughtercard
  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • PCB Connector Type : PCB Mount Header
  • Shroud Style : Fully Shrouded

Signal Characteristics


  • Differential Impedance (OHM) : 100

Termination Features


  • Termination Method to PCB : Through Hole - Press-Fit

Usage Conditions


  • Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]
Buy Now
D-Sub Connector Assemblies - 17-2286121-1-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
D-Sub Connector Assemblies
17-2286121-1-ND
D-Sub Connector Assemblies 17-2286121-1-ND
MULTIGIG RT2-R, DC, SPACE VPX MO

MULTIGIG RT2-R, DC, SPACE VPX MO

Buy Now Datasheet
Backplane Connectors - 2286121-1 - Powell Electronics, Inc.
Powell Electronics, Inc.
Swedesboro, NJ, United States
Backplane Connectors
2286121-1
Backplane Connectors 2286121-1
MULTIGIG RT2-R, DC, SPACE VPX MODULE 16E

MULTIGIG RT2-R, DC, SPACE VPX MODULE 16E

Buy Now
Multigig Rt2-R, Dc, Space Vpx Module 16E Amp - Te Connectivity - 75AC7641 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Multigig Rt2-R, Dc, Space Vpx Module 16E Amp - Te Connectivity
75AC7641
Multigig Rt2-R, Dc, Space Vpx Module 16E Amp - Te Connectivity 75AC7641
MULTIGIG RT2-R, DC, SPACE VPX MODULE 16E

MULTIGIG RT2-R, DC, SPACE VPX MODULE 16E

Supplier's Site

Technical Specifications

  TE Connectivity DigiKey Powell Electronics, Inc. Newark, An Avnet Company
Product Category Board Mount Connectors Electrical Connectors Electrical Connectors Electrical Connectors
Product Number 2286121-1 17-2286121-1-ND 2286121-1 75AC7641
Product Name High Speed Backplane Connectors D-Sub Connector Assemblies Backplane Connectors Multigig Rt2-R, Dc, Space Vpx Module 16E Amp - Te Connectivity
Category Board to Board Connector
Termination Through Hole - Press-Fit
Mounting Board Mount
Voltage Rating 50 volts
Unlock Full Specs
to access all available technical data

Related Documents