Body Features Body Material : PA GF Connector & Keying Code : C PCB Retention Feature Plating Material : Tin
Configuration Features Number of Positions : 1 PCB Mount Orientation : Horizontal
Contact Features Center Contact : With Contact Mating Area Plating Material : Gold Contact Type : Pin Mating Pin Diameter : .5 MM [.02 INCH ] RF Connector Center Contact Plating Material : Tin (Sn)
Dimensions Connector Height : 10.95 MM [.427 INCH ] Product Length : 19.5 MM [.76 INCH ] Product Width : 10.4 MM [.405 INCH ]
Electrical Characteristics Impedance (OHM) : 50 Operating Voltage (VAC) : 40 Operating Voltage (VDC) : 60
Housing Features Housing Color : Blue
Industry Standards Agency/Standard : USCAR
Mechanical Attachment Mating Retention : With PCB Mount Retention : Without PCB Mount Retention Type : Boardlock Panel Attachment Style : Front Mount
Operation/Applicatio
n Assembly Process Feature : Board Standoff Circuit Application : Signal Shielded : Yes
Other Dielectric Material : PCT Outer Contact Plating Material : Tin (Sn) Solder Process : Wave Solder
Packaging Features Packaging Method : Box & Tray Packaging Quantity : 540
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Device Hybrid Connector : No Sealable : No
Signal Characteristics Operating Frequency Range (MHZ) : 0 - 6000
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature (Max) : 75 DEGC , 105 DEGC , 80 DEGC , 70 DEGC , 65 DEGC , 100 DEGC , 90 DEGC , 85 DEGC [185 DEGF , 194 DEGF , 212 DEGF , 176 DEGF , 158 DEGF , 221 DEGF , 149 DEGF , 167 DEGF ] Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Body Features
- Body Material : PA GF
- Connector & Keying Code : C
- PCB Retention Feature Plating Material : Tin
Configuration Features
- Number of Positions : 1
- PCB Mount Orientation : Horizontal
Contact Features
- Center Contact : With
- Contact Mating Area Plating Material : Gold
- Contact Type : Pin
- Mating Pin Diameter : .5 MM [.02 INCH ]
- RF Connector Center Contact Plating Material : Tin (Sn)
Dimensions
- Connector Height : 10.95 MM [.427 INCH ]
- Product Length : 19.5 MM [.76 INCH ]
- Product Width : 10.4 MM [.405 INCH ]
Electrical Characteristics
- Impedance (OHM) : 50
- Operating Voltage (VAC) : 40
- Operating Voltage (VDC) : 60
Housing Features
Industry Standards
Mechanical Attachment
- Mating Retention : With
- PCB Mount Retention : Without
- PCB Mount Retention Type : Boardlock
- Panel Attachment Style : Front Mount
Operation/Application
- Assembly Process Feature : Board Standoff
- Circuit Application : Signal
- Shielded : Yes
Other
- Dielectric Material : PCT
- Outer Contact Plating Material : Tin (Sn)
- Solder Process : Wave Solder
Packaging Features
- Packaging Method : Box & Tray
- Packaging Quantity : 540
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Wire-to-Device
- Hybrid Connector : No
- Sealable : No
Signal Characteristics
- Operating Frequency Range (MHZ) : 0 - 6000
Termination Features
- Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
- Operating Temperature (Max) : 75 DEGC , 105 DEGC , 80 DEGC , 70 DEGC , 65 DEGC , 100 DEGC , 90 DEGC , 85 DEGC [185 DEGF , 194 DEGF , 212 DEGF , 176 DEGF , 158 DEGF , 221 DEGF , 149 DEGF , 167 DEGF ]
- Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]