Body Features Shell Base Material : Beryllium Copper Shell Plating Material : Gold
Configuration Features Number of Positions : 1
Contact Features Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 50 Contact Mating Retention : Without Contact Orientation : Right Angle Contact Type : Pin
Dimensions PCB Thickness (Recommended) : 3.18 MM [.125 INCH ]
Electrical Characteristics Impedance Options : Fixed
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board RF Contact Style : Coax
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Body Features
- Shell Base Material : Beryllium Copper
- Shell Plating Material : Gold
Configuration Features
Contact Features
- Contact Current Rating (Max) (AMP) : 1
- Contact Mating Area Plating Material : Gold
- Contact Mating Area Plating Material Thickness (MICIN) : 50
- Contact Mating Retention : Without
- Contact Orientation : Right Angle
- Contact Type : Pin
Dimensions
- PCB Thickness (Recommended) : 3.18 MM [.125 INCH ]
Electrical Characteristics
- Impedance Options : Fixed
Operation/Application
- Circuit Application : Power & Signal
Packaging Features
- Packaging Method : Package
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- RF Contact Style : Coax
Usage Conditions
- Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
