Body Features Shell Base Material : Stainless Steel Shell Plating Material : Gold
Configuration Features Number of Positions : 1
Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Mating Retention : Without Contact Orientation : Right Angle Contact Type : Pin
Dimensions PCB Thickness (Recommended) : 3.18 MM [.125 INCH ]
Electrical Characteristics Impedance (OHM) : 50 Impedance Options : Fixed
Operation/Applicatio
n Circuit Application : Power & Signal
Other Dielectric Material : Polytetrafluoroethyl
ene (PTFE)
Packaging Features Packaging Method : Package
Product Type Features Connector & Contact Terminates To : Printed Circuit Board RF Contact Style : Coax
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Body Features
- Shell Base Material : Stainless Steel
- Shell Plating Material : Gold
Configuration Features
Contact Features
- Contact Base Material : Beryllium Copper
- Contact Current Rating (Max) (AMP) : 1
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness (MICIN) : 30
- Contact Mating Retention : Without
- Contact Orientation : Right Angle
- Contact Type : Pin
Dimensions
- PCB Thickness (Recommended) : 3.18 MM [.125 INCH ]
Electrical Characteristics
- Impedance (OHM) : 50
- Impedance Options : Fixed
Operation/Application
- Circuit Application : Power & Signal
Other
- Dielectric Material : Polytetrafluoroethylene (PTFE)
Packaging Features
- Packaging Method : Package
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- RF Contact Style : Coax
Usage Conditions
- Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
