Body Features Heat Sink Finish : Anodized Clear Heat Sink Height : 5 MM [.197 INCH ] Heat Sink Style : Fin
Configuration Features Number of Fins : 36 Port Matrix Configuration : 1 x 1
Contact Features Contact Current Rating (Max) (AMP) : .5
Electrical Characteristics Data Rate (Max) (GBS) : 100
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal For Use With Pluggable I/O Products : CFP Assembly Heat Sink Compatible : Yes
Packaging Features Packaging Method : Box
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board Form Factor : CFP Pluggable I/O Accessory Type : Heat Sink Pluggable I/O Product Type : Accessory Product Line : CFP Sealable : No Thermal Accessory Type Included : Heat Sink
Termination Features Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
Body Features
- Heat Sink Finish : Anodized Clear
- Heat Sink Height : 5 MM [.197 INCH ]
- Heat Sink Style : Fin
Configuration Features
- Number of Fins : 36
- Port Matrix Configuration : 1 x 1
Contact Features
- Contact Current Rating (Max) (AMP) : .5
Electrical Characteristics
- Data Rate (Max) (GBS) : 100
Mechanical Attachment
- Connector Mounting Type : Board Mount
Operation/Application
- Circuit Application : Signal
- For Use With Pluggable I/O Products : CFP Assembly
- Heat Sink Compatible : Yes
Packaging Features
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Cable-to-Board
- Form Factor : CFP
- Pluggable I/O Accessory Type : Heat Sink
- Pluggable I/O Product Type : Accessory
- Product Line : CFP
- Sealable : No
- Thermal Accessory Type Included : Heat Sink
Termination Features
- Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions
- Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]