Body Features Terminal Profile : Low
Configuration Features Number of Positions : 1 PCB Mount Orientation : Vertical
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 90 Contact Mating Area Plating Material : Tin (Sn) Contact Mating Area Plating Material Finish : Matte Contact Mating Area Plating Material Thickness : 5 - 10 MICM [196.85 - 393.7 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Finish : Matte PCB Contact Termination Area Plating Material Thickness : 5 - 10 MICM [196.85 - 393.7 MICIN ]
Mechanical Attachment Thread Size : M5
Packaging Features Packaging Method : Package
Product Type Features Power Terminal Type : Pin Power Terminal
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -40 - 155 DEGC [-40 - 311 DEGF ]
TE Connectivity
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Description
Body Features Terminal Profile : Low
Configuration Features Number of Positions : 1 PCB Mount Orientation : Vertical
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 90 Contact Mating Area Plating Material : Tin (Sn) Contact Mating Area Plating Material Finish : Matte Contact Mating Area Plating Material Thickness : 5 - 10 MICM [196.85 - 393.7 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Finish : Matte PCB Contact Termination Area Plating Material Thickness : 5 - 10 MICM [196.85 - 393.7 MICIN ]
Mechanical Attachment Thread Size : M5
Packaging Features Packaging Method : Package
Product Type Features Power Terminal Type : Pin Power Terminal
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -40 - 155 DEGC [-40 - 311 DEGF ]
Body Features Terminal Profile : Low
Configuration Features Number of Positions : 1 PCB Mount Orientation : Vertical
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 90 Contact Mating Area Plating Material : Tin (Sn) Contact Mating Area Plating Material Finish : Matte Contact Mating Area Plating Material Thickness : 5 - 10 MICM [196.85 - 393.7 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Finish : Matte PCB Contact Termination Area Plating Material Thickness : 5 - 10 MICM [196.85 - 393.7 MICIN ]
Mechanical Attachment Thread Size : M5
Packaging Features Packaging Method : Package
Product Type Features Power Terminal Type : Pin Power Terminal
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Surface Mount
Usage Conditions Operating Temperature Range : -40 - 155 DEGC [-40 - 311 DEGF ]
Body Features
Terminal Profile : Low
Configuration Features
Number of Positions : 1
PCB Mount Orientation : Vertical
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : 90
Contact Mating Area Plating Material : Tin (Sn)
Contact Mating Area Plating Material Finish : Matte
Contact Mating Area Plating Material Thickness : 5 - 10 MICM [196.85 - 393.7 MICIN ]
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Tin
PCB Contact Termination Area Plating Material Finish : Matte
PCB Contact Termination Area Plating Material Thickness : 5 - 10 MICM [196.85 - 393.7 MICIN ]
Mechanical Attachment
Thread Size : M5
Packaging Features
Packaging Method : Package
Product Type Features
Power Terminal Type : Pin Power Terminal
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to PCB : Surface Mount
Usage Conditions
Operating Temperature Range : -40 - 155 DEGC [-40 - 311 DEGF ]