Configuration Features Number of Positions : 16 Number of Power Positions : 4 Number of Signal Positions : 12 PCB Mount Orientation : Vertical
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 25 Contact Layout : Inline Contact Mating Area Plating Material : Gold or Gold Flash over Palladium Nickel Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Dimensions Power Contact Centerline : 2.54 MM [1 INCH ]
Electrical Characteristics Operating Voltage (V) : 250
Housing Features Centerline (Pitch) : 2.5 MM , 2.54 MM [1 INCH , .098 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mount Alignment : With PCB Mount Retention : With PCB Mount Retention Type : Retention Leg
Operation/Applicatio
n Circuit Application : Power & Signal
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Configuration Features
- Number of Positions : 16
- Number of Power Positions : 4
- Number of Signal Positions : 12
- PCB Mount Orientation : Vertical
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : 25
- Contact Layout : Inline
- Contact Mating Area Plating Material : Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Dimensions
- Power Contact Centerline : 2.54 MM [1 INCH ]
Electrical Characteristics
- Operating Voltage (V) : 250
Housing Features
- Centerline (Pitch) : 2.5 MM , 2.54 MM [1 INCH , .098 INCH ]
Mechanical Attachment
- Connector Mounting Type : Board Mount
- PCB Mount Alignment : With
- PCB Mount Retention : With
- PCB Mount Retention Type : Retention Leg
Operation/Application
- Circuit Application : Power & Signal
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Board-to-Board
Termination Features
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]