TE Connectivity LGA Sockets 2201838-1

Body Features Frame Style : Square Configuration Features Grid Spacing : 1.016 x .8814 MM  [.040 x .0347 INCH ] Number of Positions : 2011 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 IC Socket Type : LGA 2011 Housing Features Centerline (Pitch) : 1.02 MM  [.04 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount PCB Mounting Style : Surface Mount Solder Ball Operation/Applicatio n Circuit Application : Signal Other Socket Connector Comment : Lead-Free Solderball Packaging Features Packaging Method : Tray Tray Color : Black Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Usage Conditions Operating Temperature Range : -25 - 100 DEGC  [-13 - 212 DEGF ]