TE Connectivity High Speed Backplane Connectors 2187345-1

Body Features

• Primary Product Color : Black
• Shield Material : Copper Alloy

Configuration Features

• Backplane Architecture : Traditional Backplane
• Number of Columns : 8
• Number of Ground Positions : 72
• Number of Positions : 128
• Number of Rows : 8
• Number of Signal Positions : 128
• PCB Mount Orientation : Vertical
• Pairs per Column : 8

Contact Features

• Contact Base Material : Copper Alloy
• Contact Current Rating (Max) (AMP) : .4
• Contact Shape & Form : Dual Beam
• Contact Type : Pin
• PCB Contact Termination Area Plating Material : Tin

Dimensions

• Row-to-Row Spacing : 2.5 MM  [.098 INCH ]

Electrical Characteristics

• Impedance (OHM) : 85
• Operating Voltage (VAC) : 80

Housing Features

• Centerline (Pitch) : 3.9 MM  [.154 INCH ]
• Housing Material : Liquid Crystal Polymer (LCP)
• Number of Shrouded Sides : 4

Industry Standards

• Compatible With Agency/Standards Products : UL
• Compatible With Approved Standards Products : UL E28476
• UL Flammability Rating : UL 94V-0

Mechanical Attachment

• Guide Hardware : Without
• Mating Alignment : With
• Mating Alignment Type : Keyed
• Mating Retention : Without
• PCB Mount Retention : With
• PCB Mount Retention Type : Action/Compliant Tail

Operation/Application

• Circuit Application : Signal
• Durability Rating (CYCLE) : 200

Packaging Features

• Packaging Method : Tube

Product Type Features

• Backplane Module Type : Center
• Connector & Contact Terminates To : Printed Circuit Board
• Connector System : Board-to-Board
• PCB Connector Type : PCB Mount Header
• Shroud Style : Fully Shrouded
• Signal Arrangement : Differential

Signal Characteristics

• Data Rate (GBS) : 56
• Differential Impedance (OHM) : 85
• Number of Differential Pairs per Column : 8

Termination Features

• Termination Method to PCB : Through Hole - Press-Fit

Usage Conditions

• Operating Temperature Range : -55 - 105 DEGC  [-67 - 221 DEGF ]